Presentations -
-
パルスプラズマにおける負イオンエネルギー分布の時間 分解測定
都地 一輝, 堤 隆嘉, 蕭 世男, 関根 誠, 堀 勝, 石川 健治
第71回応用物理学会春期学術講演会 2024.3.24
-
Prediction Model for RF Bias Effect on Etch Resistance of Amorphous Carbon in Plasma Enhanced Chemical Vapor Deposition International conference
Y. Ando, H. Kondo, T. Tsutsumi, K. Ishikawa, M. Sekine, M. Hori
ISPlasma2024/IC-PLANTS2024/APSPT-13 2024.3.4
-
In-situ analysis of chemisorption reactions on SiO2 surface using carbon precursor containing halogen International coauthorship International conference
L. Hu, T. Tsutsumi, N. Kobayashi, D. C. P. Raj, R. Borude, K. Ishikawa, M. Hori
ISPlasma2024/IC-PLANTS2024/APSPT-13 2024.3.5
-
In-situ analysis of chemisorption reactions on SiO2 surface using carbon precursor containing halogen International coauthorship International conference
L. Hu, T. Tsutsumi, N. Kobayashi, D. C. P. Raj, R. Borude, K. Ishikawa, M. Hori
ISPlasma2024/IC-PLANTS2024/APSPT-13 2024.3.5
-
Prediction Model for RF Bias Effect on Etch Resistance of Amorphous Carbon in Plasma Enhanced Chemical Vapor Deposition International conference
Y. Ando, H. Kondo, T. Tsutsumi, K. Ishikawa, M. Sekine, M. Hori
ISPlasma2024/IC-PLANTS2024/APSPT-13 2024.3.4
-
In-situ observation of plasma-induced damage and radical adsorption for Atomic Layer Etching Invited
SPP-41 2024.1.25
-
In-situ observation of plasma-induced damage and radical adsorption for Atomic Layer Etching Invited
SPP-41 2024.1.25
-
Control of etching profile by bias supply timing in cyclic process using C4F8/SF6 gas modulated plasma International conference
T. Yoshie, K. Ishikawa, T. Tsutsumi, M. Sekine, M. Hori
The 44th International Symposium on Dry Process (DPS2023) 2023.11.22
-
Defect characterization at SiO2/Si interface throughout plasma processing and annealing International conference
S.Nunomura, T.Tsutsumi, I. Sakata and M Hori
The 44th International Symposium on Dry Process (DPS2023) 2023.11.22
-
A pseudo-wet cryogenic plasma etching of SiO2 investigated with in-situ surface monitoring International conference
S-N Hsiao, M. Sekine, K. Ishikawa, T.Tsutsumi, and M. Hori Y Iijima, R. Suda, Y. Kihara
The 44th International Symposium on Dry Process (DPS2023) 2023.11.22
-
Electron-Beam-Assisted Self-limiting fluorination of GaN surface using XeF2 for Atomic Layer Etching International conference
Y. Izumi, T. Tsutsumi, H Kondo, M. Sekine, M. Hori, K. Ishikawa
The 44th International Symposium on Dry Process (DPS2023) 2023.11.21
-
Compositions of Ions Related with Electrode Materials in Pulsed Plasma for High-Aspect-Ratio Hole Etching International conference
K. Toji, T. Tsutsumi, S-N. Hsiao, M. Sekine, M. Hori, K. Ishikawa
The 44th International Symposium on Dry Process (DPS2023) 2023.11.21
-
Etch selectivities of SiO2 and SiN against a-C films using CF4/H2 plasma at low temperature International conference
Y. Imai, S-N. Hsiao, M. Sekine, K. Ishikawa, T. Tsutsumi, M. Iwata, M. Tomura, Y. Iijima, K. Matsushima, M. Hori
The 44th International Symposium on Dry Process (DPS2023) 2023.11.21
-
A pseudo-wet cryogenic plasma etching of SiO2 investigated with in-situ surface monitoring International conference
S-N Hsiao, M. Sekine, K. Ishikawa, T.Tsutsumi, M. Hori Y Iijima, R. Suda, Y. Kihara
The 44th International Symposium on Dry Process (DPS2023) 2023.11.22
-
Defect characterization at SiO2/Si interface throughout plasma processing and annealing International conference
S.Nunomura, T.Tsutsumi, I. Sakata, M Hori
The 44th International Symposium on Dry Process (DPS2023) 2023.11.22
-
Control of etching profile by bias supply timing in cyclic process using C4F8/SF6 gas modulated plasma International conference
T. Yoshie, K. Ishikawa, T. Tsutsumi, M. Sekine, M. Hori
The 44th International Symposium on Dry Process (DPS2023) 2023.11.22
-
Compositions of Ions Related with Electrode Materials in Pulsed Plasma for High-Aspect-Ratio Hole Etching International conference
K. Toji, T. Tsutsumi, S-N. Hsiao, M. Sekine, M. Hori, K. Ishikawa
The 44th International Symposium on Dry Process (DPS2023) 2023.11.21
-
Electron-Beam-Assisted Self-limiting fluorination of GaN surface using XeF2 for Atomic Layer Etching International conference
Y. Izumi, T. Tsutsumi, H Kondo, M. Sekine, M. Hori, K. Ishikawa
The 44th International Symposium on Dry Process (DPS2023) 2023.11.21
-
Etch selectivities of SiO2 and SiN against a-C films using CF4/H2 plasma at low temperature International conference
Y. Imai, S-N. Hsiao, M. Sekine, K. Ishikawa, T. Tsutsumi, M. Iwata, M. Tomura, Y. Iijima, K. Matsushima, M. Hori
The 44th International Symposium on Dry Process (DPS2023) 2023.11.21
-
ドライエッチングと原子層エッチングの基礎と応用 Invited
堤 隆嘉
第34回 プラズマエレクトロニクス講習会 2023.11.17