研究者詳細 - 秦　誠一

論文 - 秦　誠一

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Combinatorial searching system for electrolysis catalytic materials 査読有り

Miyamoto M., Suzuki A., Mizoshiri M., Sakurai J., Hata S.

2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015 2016年3月

記述言語：英語掲載種別：研究論文（国際会議プロシーディングス）出版者・発行元：2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015

In this study, we proposed to search for new electrode catalyst for the electrolysis of brine using a combinatorial method. The evaluation substrate consisting of 72 catalyst samples and 9 Pt reference electrodes was designed and fabricated by micro electro mechanical system (MEMS) techniques. The thin film electrode catalyst library on the evaluation substrate was prepared by a combinatorial multi target sputtering system. To evaluation the characteristics of catalyst samples, the polarization curves (current density/potential curves) of catalyst samples were measured by the potential sweep method. Surface poisoning and elution of catalysis samples were observed by an optical microscopy. Finally, we confirmed that the proposed combinatorial method was useful to search for new electrode catalytic materials.

DOI： 10.1109/MHS.2015.7438321

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Thin-film thermoelectric generator with ball lens for using near-infrared solar energy 査読有り

Ito Y., Mizoshiri M., Mikami M., Kondou T., Sakurai J., Hata S.

2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015 2016年3月

記述言語：英語掲載種別：研究論文（国際会議プロシーディングス）出版者・発行元：2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015

A thin-film thermoelectric generator (TEG) with ball lenses which enable the visible light to pass through was designed and fabricated. When diameters of the ball lens and the pinhole were 6 mm and 200 μm, respectively, 76% of the visible light and 36% of the infrared light were transmissive to the TEG under the condition that the ball lens position from the device substrate was 0 μm. Thin-film TEGs were fabricated using lithography and thermoelectric thin film deposition processes. The thin film thermoelectric elements were formed on the glass substrate without removal by inserting the Cr buffer layers between the thermoelectric thin films and the substrate. The width of the elements were up to 10 μm greater than that of the designed one. The difference between the fabricated and the designed one was less than 10%, which is negligible value for the internal resistance of the TEGs.

DOI： 10.1109/MHS.2015.7438318

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Direct writing of Cu -based micro -temperature detectors using femtosecond laser reduction of CuO nanoparticles 査読有り

Mizoshiri, M; Arakane, S; Sakurai, J; Hata, S

APPLIED PHYSICS EXPRESS 9 巻 ( 3 ) 頁： 36701 - 36701 2016年3月

記述言語：英語出版者・発行元：Institute of Physics

Cu-based micro-temperature detectors were fabricated using femtosecond laser reduction of CuO nanoparticles. Cu-based microstructures were directly created by laser scanning on a CuO nanoparticle solution film. Cu-rich and Cu<inf>2</inf>O-rich microstructures were selectively formed to electrically connect two Cu thin-film electrodes for use in temperature detectors. Cu-rich and Cu<inf>2</inf>O-rich micro-temperature detectors were fabricated at scanning speeds of 500 and 1000 µm/s, respectively, at a pulse energy of 1.2 nJ. The temperature coefficient of resistance values of the Cu-rich and Cu<inf>2</inf>O-rich microstructures were positive and negative, respectively; these temperature behaviors are typical of metal and semiconductor materials, respectively.

DOI： 10.7567/APEX.9.036701

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6. 機械材料・材料加工(<小特集>技術ロードマップから見る2030年の社会) 招待有り査読有り

秦誠一, 大塚年久, 古川英光, 中尾航

日本機械学会誌 119 巻 ( 1170 ) 頁： 300 - 302 2016年

Fabrication of Combinatorial Evaluation Substrates for Chlorine Evolution Electrode Catalyst 査読有り

Takagi, S; Miyamoto, M; Mizoshiri, M; Hata, S; Sakurai, J

2016 INTERNATIONAL SYMPOSIUM ON MICRO-NANOMECHATRONICS AND HUMAN SCIENCE (MHS) 2016年

高成形性形状記憶合金の熱的特性のハイスループット評価法

村上元規, 溝尻瑞枝, 秦誠一, 櫻井淳平

年次大会 2016 巻 ( 0 ) 頁： J2240101 2016年

脱合金化法を用いたナノポーラス電極膜フィルタの製作とセンサへの応用

吉井雄佑, 溝尻瑞枝, 櫻井淳平, 秦誠一

年次大会 2016 巻 ( 0 ) 頁： J2240203 2016年

塩素発生用電極触媒のコンビナトリアル評価基板の作製

高木進吾, 宮本将志, 溝尻瑞枝, 秦誠一, 櫻井淳平

年次大会 2016 巻 ( 0 ) 頁： J2240103 2016年

受動型ドラッグデリバリーシステムの薬液投与特性

粂野勇貴, 高桑暁, 伊藤啓太郎, 溝尻瑞枝, 櫻井淳平, 新井史人, 秦誠一

年次大会 2016 巻 ( 0 ) 頁： J2230101 2016年

ボールレンズを用いた可視光透過型薄膜熱電発電デバイスの作製

伊藤嘉崇, 溝尻瑞枝, 三上祐史, 櫻井淳平, 秦誠一

年次大会 2016 巻 ( 0 ) 頁： J2240204 2016年

Ti-Ni-Zr高成形性形状記憶合金のマイクロ成形加工

渡邊寛人, 溝尻瑞枝, 秦誠一, 櫻井淳平

年次大会 2016 巻 ( 0 ) 頁： J2240105 2016年

自己組織化による3次元微細周期構造形成のための微小パーツの作製

飯嶋勇樹, 溝尻瑞枝, 櫻井淳平, 秦誠一

年次大会 2016 巻 ( 0 ) 頁： J2240201 2016年

薄膜金属ガラスを用いたマイクロ構造体の内部応力制御

安部修平, 前谷卓哉, 溝尻瑞枝, 櫻井淳平, 秦誠一

年次大会 2016 巻 ( 0 ) 頁： J2240102 2016年

Characteristics of Ti-Ni-Zr thin film metallic glasses / thin film shape memory alloys for micro actuators with three-dimensional structures

Sakurai J., Hata S.

International Journal of Automation Technology 9 巻 ( 6 ) 頁： 662 - 667 2015年11月

記述言語：英語掲載種別：研究論文（学術雑誌）出版者・発行元：富士技術出版株式会社

In this paper, we investigate the characteristics of Ti-Ni-Zr thin film metallic glasses (TFMGs)/shape memory alloys (SMAs) for microelectromechanical systems (MEMS) applications with three-dimensional structures. The amorphous Ti-Ni-Zr thin films having a Ni content of more than 50 at.% and Zr content of more than 11 at.% undergo glass transitions and are TFMGs. The Ti39Ni50Zr11 TFMG has the lowest glass transition temperature Tg of 703 K and a wide supercooled liquid region ΔT of 57 K. Moreover, it has high thermal stability at Tg. However, the apparent viscosity of the Ti39Ni50Zr11 is higher than those of other Ti-Ni-Zr TFMGs. Moreover, the Ti-Ni-Zr TFMG exhibits higher viscosity than conventional TFMGs because the alloy composition of Ti-Ni-Zr TFMGs/SMAs is far from the eutectic point.

DOI： 10.20965/ijat.2015.p0662

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Reverse lift-off process and application for Cu-Zr-Ti metallic glass thick film structures

Watanabe S., Sakurai J., Mizoshiri M., Hata S.

International Journal of Automation Technology 9 巻 ( 6 ) 頁： 646 - 654 2015年11月

記述言語：英語掲載種別：研究論文（学術雑誌）出版者・発行元：富士技術出版株式会社

In technologies involving micro electromechanical systems, lift-off processes combined with sputter deposition are general patterning methods for the formation of amorphous alloy thick film structures. However, the thicknesses of structures fabricated in this manner are not uniform because sputtered particles are blocked by the sidewalls of the lift-off layer. In this paper, a reverse lift-off process is proposed as a new patterning method for fabricating amorphous alloy thick film structures of uniform thickness. In the reverse lift-off process, a template of the desired structure is formed on top of the chosen substrate. The thick film structure is then formed by sputter deposition on the top surface of the template. In contrast to a conventional liftoff process, here the thickness of the structure is uniform because there is nothing to hinder the sputtered particles. To demonstrate this process, we successfully fabricated a Cu-Zr-Ti metallic glass thick film structure with a uniform film thickness and a rectangular cross section across different target structure widths and thicknesses. This demonstrates that the reverse lift-off process is more suitable than conventional liftoff processes for the fabrication of metallic glass thick film structures.

DOI： 10.20965/ijat.2015.p0646

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Direct patterning of Cu microstructures using femtosecond laser-induced CuO nanoparticle reduction 査読有り

Arakane, S; Mizoshiri, M; Hata, S

JAPANESE JOURNAL OF APPLIED PHYSICS 54 巻 ( 6 ) 2015年6月

記述言語：英語掲載種別：研究論文（学術雑誌）出版者・発行元：Japanese Journal of Applied Physics

Cu-based microstructures were directly patterned using femtosecond laser-induced CuO nanoparticle reduction. CuO nanoparticle-based solution, consisting CuO nanoparticles, ethylene glycol, and polyvinylpyrrolidone, was spin-coated on glass substrates. Microstructures were formed by irradiating focused femtosecond laser pulses. Cu and Cu2O peak intensities were observed in the X-ray diffraction (XRD) spectra of the microstructures. Compared to single scan, the Cu peak intensities increased by double scan. This result suggests that double scan is effective for increasing the amount of Cu from CuO nanoparticle solution. Cu- and Cu2O-rich microstructures were formed selectively by controlling laser irradiation conditions. The resistivity of the Cu-rich microstructures was estimated by 528 μΩm which was 104 times and 10 times larger than the values of Cu and Cu2O, respectively. This large resistivity could be applied for microheaters.

DOI： 10.7567/JJAP.54.06FP07

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REDUCTION PROPERTIES OF NICKEL MICROSTRUCTURES FABRICATED BY DIRECT FEMTOSECOND LASER REDUCTION PATTERNING 査読有り

Mizue Mizoshiri, Kenki Tamura, Junpei Sakurai, Seiichi Hata

Proceedings of 2015 ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment 頁： MoB-2-2 2015年6月

Fabrication of Cu-Zr-Ti thick film metallic glass structure by double metal mask lift-off process 査読有り

Watanabe, S; Sakurai, J; Hata, S

MICROELECTRONIC ENGINEERING 135 巻頁： 45 - 51 2015年3月

記述言語：英語掲載種別：研究論文（学術雑誌）出版者・発行元：Microelectronic Engineering

In micro-electro-mechanical systems (MEMS) technology, one of the conventional patterning methods used for metallic thin films is the lift-off process using a photoresist material. However, there is concern regarding the photoresist material generating gas due to the long-term annealing or the high power used in sputter deposition. Thin-film amorphous alloys, such as thin-film metallic glass (TFMG), when used in the device, become crystallized by such heating and outgassing during sputtering. Unlike photoresist material, a metal mask does not generate gas during sputtering. However, a metal mask is subject to deformation by the stress in the sputtered film on the mask. The pattern shape of the TFMG structure can thus collapse due to this mask deformation. Its cross-sectional shape then deviates significantly from a rectangle. We propose a novel lift-off process using a double metal mask for reducing changes in the cross-sectional shape, and maintaining the amorphous nature of the TFMG structure. The characteristic of the double metal mask lift-off process is duplication of the metal mask for restraint of the lower metal mask deformation. Since nearly all of the sputtered material is deposited on the upper metal mask, the material is only minimally deposited onto the lower metal mask. In this work, the double metal mask lift-off process was compared with the conventional lift-off process, and important points for using the double metal mask lift-off process were elucidated. Using the double metal mask lift-off process, a very thick amorphous TFMG structure could be obtained, as compared to the conventional lift-off process. To maintain the rectangular cross-sectional shape of the structure, it was found to be necessary to decrease the height of the double metal mask, as compared to the conventional lift-off process, in anticipation of upper metal mask deformation.

DOI： 10.1016/j.mee.2015.02.041

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Influence of target-target distance for composition distribution in new facing targets sputtering

Maetani T., Nakamitsu Y., Sakurai J., Hata S.

2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 2015年1月

出版者・発行元：2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014

Combinatorial New-Facing Targets Sputtering (combi-NFTS) is one of the co-sputtering method applied to the combinatorial method. Combi-NFTS could easily control the composition range by changing the distance from substrate to targets. Furthermore composition gradient is relatively linear comparing to other thin film deposition method. In this paper, the influence of the distance between target and target gives for the composition distribution is investigated. As a result, it was elucidated that composition distribution and gradient increase as the TT distance increase. This is caused by the peak position of amount of deposited sputtering atom on the substrate change by the TT distance.

DOI： 10.1109/MHS.2014.7006100

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6・2・6 特殊加工(6・2 材料加工,6.機械材料・材料加工,<特集>機械工学年鑑) 招待有り

秦誠一

日本機械学会誌 118 巻 ( 1161 ) 頁： 468 2015年

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