研究者詳細 - 松山　智至

論文 - 松山　智至

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単結晶圧電素子を用いた形状可変ミラーの開発

上松航太, 中林荘太, 井上陽登, 松山智至

精密工学会学術講演会講演論文集 2022S 巻 ( 0 ) 頁： 116 - 116 2022年3月

担当区分：最終著者記述言語：日本語出版者・発行元：公益社団法人精密工学会

高分解能な結像型X線顕微鏡を実現するためには、より高精度な光学素子が必要となる。しかし、光学素子の作製精度は限界に達しており、この問題解決のため形状可変ミラーの導入を進めている。これまでの形状可変ミラーは、高空間周波数の形状が制御不能、圧電素子由来の不安定性などの欠点を有する。そこで、本研究では単結晶圧電素子を用いた新構造の形状可変ミラーを提案、試作し、性能評価を実施した。

DOI： 10.11522/pscjspe.2022s.0_116

CiNii Research

ニオブ酸リチウム単結晶を用いたX線用形状可変ミラーの開発

中林荘太, 松山智至, 上松航太

精密工学会学術講演会講演論文集 2022S 巻 ( 0 ) 頁： 661 - 661 2022年3月

記述言語：日本語出版者・発行元：公益社団法人精密工学会

X線領域では、高精度な光学素子が必要とされる。しかし、その作成難易度は限界(1nm)に到達しつつあり、これら光学素子によって乱された波面を形状可変ミラーによって修正する戦略が今後重要となる。本研究では、単結晶圧電素子であるニオブ酸リチウムを用いた極シンプルな形状可変ミラーを試作した。SPring-8にてＸ線波面計測を試みたところ、試作した形状可変ミラーが意図したとおり変形できることを確認した。

DOI： 10.11522/pscjspe.2022s.0_661

CiNii Research

Preparation of highly planarized optical surface on Si substrate via catalyst-referred etching

Itagaki K., Toh D., Van Bui P., Matsuyama S., Yamauchi K., Sano Y.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022 頁： 105 - 106 2022年

記述言語：英語出版者・発行元：European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022

In recent years, crystalline silicon (Si) has been used as a promising material for precision X-ray mirrors and Bragg optics. These devices require extremely well-ordered surfaces without crystallographic damage. Thus, we applied an ultra-precision polishing method called catalyst-referred etching (CARE) to planarize crystalline Si substrates. CARE is a catalyzed chemical etching method that uses pure water as an etchant and a catalytic pad that promotes the designed reactions. Owing to its abrasive-free nature, the polished surface reaches an atomic-level smoothness suitable for application to excellent optical devices, particularly in the X-ray regime. Understanding the mechanism of this method is essential for its wide practical application. CARE has been successfully applied to silicon dioxide (SiO2) optical glasses, and the removal mechanism has been clarified to be an indirect hydrolysis reaction using first-principles calculations. In the case of Si CARE, because Si is easily oxidized by dissolved oxygen (DO) in pure water, the removal pathway may involve oxidation reactions, which may be similar to the removal mechanism of SiO2CARE. Clarifying the role of DO is essential for understanding the mechanism of Si CARE. In this study, we evaluated the processing characteristics under different DO concentrations and investigated whether the accompanying oxidation induced by DO is critically required. It was observed that Si CARE does not require oxidation. The surface roughness was observed to be drastically improved in low-DO water. We conclude that the etching mechanism of Si CARE is different from that of SiO2CARE. Thus, a first-principles investigation is possible, except for the O2molecule from relevant reactions.

Scopus

Planarization of polymer materials using catalytic reaction in pure water

Takeda K., Toh D., Van Bui P., Matsuyama S., Yamauchi K., Sano Y.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022 頁： 111 - 112 2022年

記述言語：英語出版者・発行元：European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022

In recent years, polymer materials with excellent properties, such as chemical resistance, heat resistance, and high insulation, have been produced. These materials have been widely used in advanced devices. For example, polycarbonate (PC), polymethyl methacrylate (PMMA), and polyimide (PI) are used as insulating films in microelectromechanical systems (MEMSs), and polytetrafluoroethylene (PTFE) is a promising substrate for next-generation high-frequency devices exceeding 5G. To exploit the excellent properties of these polymer materials, well-ordered surfaces are required. However, because polymer materials are extremely soft, conventional polishing methods that use abrasives cannot produce a damage-free surface. We present an abrasive-free polishing technique called catalyst-referred etching (CARE). In this method, the top surface of the workpiece is preferentially removed via an indirect hydrolysis reaction promoted by a metal catalyst. The surfaces of the amorphous and single-crystalline samples processed using CARE exhibited atomic flatness. We discuss the polishing characteristics and material removal mechanisms of polymers in CARE. The PC and PMMA were polished using Pt and pure water as the catalyst and etchant, respectively. An atomically smooth surface, which could not be fabricated by mechanical polishing, was obtained. Based on observations of the surface, the removal mechanism was estimated as follows. Molecule chains entangle to form clusters that constitute the surface of the polymer and determine the surface roughness. In CARE, the top of this cluster was selectively removed, forming a flat surface similar to that obtained on a single-crystalline polymer material. Therefore, CARE is a promising polishing method for polymer materials.

Scopus

Fabrication of an atomically smooth polycrystalline surface without grain boundary steps using catalyst-referred etching

Toh D., Van Bui P., Matsuyama S., Sano Y., Yamauchi K.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022 頁： 273 - 274 2022年

記述言語：英語出版者・発行元：European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022

Recently, polycrystalline material can express its excellent physical properties and has been used in advanced applications in semiconductors and optics. Similar to single crystal materials, to fully exploit the properties of polycrystalline material in devices, a flat surface on the atomic level is required. However, since the polycrystalline material surface has various crystal orientations, the grain boundary steps appear on the surface polished by CMP (chemical mechanical polishing). Thus, new polishing technology needs to be developed. The following two conditions are required to obtain atomically well-ordered polycrystalline material surfaces: 1) The polishing pad must always act as a reference flat to selectively remove the crystal grain located at the topmost of the sample surface. 2) The material removal must proceed via a chemical etching to avoid crystallographic damages. Therefore, we developed a chemical etching method assisted by a metal catalyst named catalyst-referred etching (CARE). In this method, a polishing pad with a catalyst thin film works as a reference plane to be copied onto the workpiece surface. A workpiece is pressed to the polishing pad in an etchant, and they rotate around their axes. Accordingly, only the grain located at the topmost site frequently contacts the catalyst and is preferentially removed chemically, leading to obtaining a damage-free surface without grain boundary steps. In this study, we demonstrated the possibility of realizing the atomically flat polycrystalline surface by applying the CARE. Polycrystalline SiC and YAG ceramics were processed using Ru catalyst and a solution having neutral pH as a catalyst and an etchant, respectively. Using this method, we obtained an extremely smooth surface with a grain boundary step less than 1 nm without introducing crystallographic damage.

Scopus

XFEL single-nanometer focusing system at SACLA

Yamada J., Matsuyama S., Inoue T., Ito A., Inoue I., Osaka T., Inubushi Y., Yumoto H., Koyama T., Ohashi H., Yamauchi K., Yabashi M.

Optics InfoBase Conference Papers 2022年

記述言語：英語出版者・発行元：Optics InfoBase Conference Papers

A sub-10 nm focusing mirror system for the XFEL has been developed to generate an ultra-intense X-ray laser field. For the sub-10 nm focusing optic, an advanced Kirkpatrick-Baez mirror system based on Wolter-type III geometry has been adopted. The mirrors were fabricated based on a strategy of X-ray wavefront correction. As the results of the performance test at SACLA, we confirmed nearly diffraction-limited wavefront accuracy, 7 nm focusing spot size, more than 10 hours stability, and ~1022 W/cm2 intensity.

DOI： 10.1364/CLEOPR.2022.CWP19B_01

Scopus

XFEL single-nanometer focusing system at SACLA

Yamada J., Matsuyama S., Inoue T., Ito A., Inoue I., Osaka T., Inubushi Y., Yumoto H., Koyama T., Ohashi H., Yamauchi K., Yabashi M.

2022 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2022 - Proceedings 2022年

出版者・発行元：2022 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2022 - Proceedings

DOI： 10.1109/CLEO-PR62338.2022.10432393

Scopus

High-throughput deterministic plasma etching using array-type plasma generator system 査読有り Open Access

Sano, Y; Nishida, K; Asada, R; Okayama, S; Toh, D; Matsuyama, S; Yamauchi, K

REVIEW OF SCIENTIFIC INSTRUMENTS 92 巻 ( 12 ) 頁： 125107 - 125107 2021年12月

記述言語：英語掲載種別：研究論文（学術雑誌）出版者・発行元：Review of Scientific Instruments

A deterministic processing method is a high-precision finishing method, where the to-be-removed amount of material at each point of the work surface is calculated based on an accurately measured present surface shape and is removed precisely using a numerically controlled (NC) processing system. Although this method has achieved nanometer-scale accuracy, the method requires considerable time to scan the work surface, leading to low productivity. Therefore, using an individual on-off controllable array-type plasma generator covering the entire work surface, enabling simultaneous NC plasma processing is proposed herein. A novel intermittent gas flow system was constructed using cyclic on-off control of the gas supply and exhaust valves instead of the commonly used continuous gas flow to achieve uniform in-plane plasma etching. It was found that uniform removal could be achieved by combining it with a pulse-modulated high-frequency power supply and setting the plasma generation time in one cycle to be sufficiently short. Furthermore, a power control approach was developed for maintaining a constant plasma state, even while varying the plasma-generating array elements, which resulted in a demonstration experiment of NC plasma etching that successfully reduced the thickness variation of a silicon substrate.

DOI： 10.1063/5.0071623

Web of Science

Scopus

PubMed

Optimal deformation procedure for hybrid adaptive x-ray mirror based on mechanical and piezo-driven bending system 査読有り国際共著 Open Access

Inoue, T; Nishioka, Y; Matsuyama, S; Sonoyama, J; Akiyama, K; Nakamori, H; Ichii, Y; Sano, Y; Shi, XB; Shu, DM; Wyman, MD; Harder, R; Kohmura, Y; Yabashi, M; Assoufid, L; Ishikawa, T; Yamauchi, K

REVIEW OF SCIENTIFIC INSTRUMENTS 92 巻 ( 12 ) 頁： 123706 - 123706 2021年12月

記述言語：英語掲載種別：研究論文（学術雑誌）出版者・発行元：Review of Scientific Instruments

A hybrid deformable x-ray mirror consisting of a mechanical bender and a bimorph deformable mirror has been developed to realize adaptive optical systems, such as zoom condenser optics, for synchrotron-radiation-based x-ray microscopy. In the developed system, both bending mechanisms comprehensively contribute to the formation of the target mirror shape and can narrow the role of piezoelectric actuators, thereby enabling a more stable operation. In this study, the behavior of the bimorph mirror under the clamped condition was investigated, and the sharing of the deformation amount for each bending mechanism was optimized to minimize the amplitude of the voltage distribution of the bimorph mirror.

DOI： 10.1063/5.0070465

Web of Science

Scopus

PubMed

その他リンク： https://aip.scitation.org/doi/pdf/10.1063/5.0070465

触媒表面基準エッチング法を用いた粒界段差フリーな超平滑多結晶材料表面の作製

藤大雪, Bui Van Pho, 松山智至, 佐野泰久, 山内和人

精密工学会学術講演会講演論文集 2021A 巻 ( 0 ) 頁： 115 - 116 2021年9月

記述言語：日本語出版者・発行元：公益社団法人精密工学会

多結晶材料の平坦化を目的とし触媒金属および純水のみを用いる触媒表面基準エッチング法の利用を提案する．本手法は基準面を有する化学エッチングで試料の凸部のみを優先的にエッチングするため，ランダムな結晶方位を有する多結晶材料表面においても，超平滑な表面を取得できる．加工試料に多結晶SiC，YAGセラミクスを準備し，本手法を適応したところ，本手法の加工特性によって粒界段差のない，原子レベルで平滑な表面を実現した．

DOI： 10.11522/pscjspe.2021a.0_115

CiNii Research

結像型X線顕微鏡における位相イメージング手法の開発

田中優人, 松山智至, 井上陽登, 山田純平, 香村芳樹, 矢橋牧名, 石川哲也, 山内和人

精密工学会学術講演会講演論文集 2021A 巻 ( 0 ) 頁： 546 - 547 2021年9月

記述言語：日本語出版者・発行元：公益社団法人精密工学会

結像型X 線顕微鏡では，試料の高空間分解能な像がリアルタイムに得られる．しかし，本顕微鏡では，コントラストの低い吸収コントラスト像しか直接観察できないことから，高いコントラストを持つ位相コントラスト像の獲得が望まれる．本研究では，様々なデフォーカス位置における試料の吸収コントラスト像を用いて，位相コントラスト像を得る手法を提案した． SPring-8 BL29XUでの実験を通して本手法の有用性を実証した．

DOI： 10.11522/pscjspe.2021a.0_546

CiNii Research

圧電素子駆動型形状可変ミラーを用いたX線sub-5 nm集光システムの開発（第2報）

井上陽登, 松山智至, 田中優人, 二村浩平, 一井愛雄, 山田純平, 佐野泰久, 香村芳樹, 矢橋牧名, 石川哲也, 山内和人

精密工学会学術講演会講演論文集 2021A 巻 ( 0 ) 頁： 545 - 545 2021年9月

記述言語：日本語出版者・発行元：公益社団法人精密工学会

大型放射光施設が発振する高強度X線をより小さく集光することで，高光子密度を活かしたX線非線形光学や，小さなスポット径を利用したナノ構造解析の発展が期待される．求める集光径が小さくなるほどミラーに必要な形状精度は厳しくなる．そこで我々は中周期以上の形状を形状可変ミラーで，短周期形状を差分成膜法で修正するハイブリッド波面補償を導入した．本システムを用いることで，回折限界集光条件を満たすことに成功した．

DOI： 10.11522/pscjspe.2021a.0_545

CiNii Research

Hard X-ray nanoprobe scanner 査読有り

Yamada, J; Inoue, I; Osaka, T; Inoue, T; Matsuyama, S; Yamauchi, K; Yabashi, M

IUCRJ 8 巻 ( Pt 5 ) 頁： 713 - 718 2021年9月

はじめての放射光X線実験

松山智至

精密工学会誌 87 巻 ( 7 ) 頁： 7_618 - 7_621 2021年7月

X-ray adaptive zoom condenser utilizing an intermediate virtual focus 査読有り Open Access

Matsuyama, S; Yamaguchi, H; Inoue, T; Nishioka, Y; Yamada, J; Sano, Y; Kohmura, Y; Yabashi, M; Ishikawa, T; Yamauchi, K

OPTICS EXPRESS 29 巻 ( 10 ) 頁： 15604 - 15615 2021年5月

記述言語：英語掲載種別：研究論文（学術雑誌）出版者・発行元：Optics Express

We propose an extended X-ray adaptive zoom condenser that can form an intermediate virtual focus. The system comprises two deformable mirrors for focusing within a single dimension and can vary its numerical aperture (NA) without changing the positions of the light source, mirrors, or final focus. The desired system NA is achieved simply by controlling the mirror surfaces, which enables conversion between convex and concave forms, by varying the position of the intermediate virtual focus. A feasibility test at SPring-8 under a photon energy of 10 keV demonstrated that the beam size can be varied between 134 and 1010 nm.

DOI： 10.1364/OE.422723

その他リンク： https://www.osapublishing.org/viewmedia.cfm?URI=oe-29-10-15604&seq=0

圧電素子駆動型形状可変ミラーを用いたX線sub-5nm集光システムの開発

井上陽登, 松山智至, 田中優人, 二村浩平, 一井愛雄, 山田純平, 佐野泰久, 香村芳樹, 矢橋牧名, 石川哲也, 山内和人

精密工学会学術講演会講演論文集 2021S 巻 ( 0 ) 頁： 668 - 668 2021年3月

記述言語：日本語出版者・発行元：公益社団法人精密工学会

大型放射光施設が発振する高強度X線をより小さく集光することで，高光子密度を活かしたX線非線形光学や，小さなスポット径を利用したナノ構造解析の発展が期待される．求める集光径が小さくなるほどミラーに必要な形状精度は厳しくなる．そこで我々は形状可変ミラーを導入し，有限要素法を用いて修正可能な形状を計算した．6周期までの正弦波型の初期形状誤差がPV-3 nm以上存在した場合においても修正可能であることがわかった．

DOI： 10.11522/pscjspe.2021s.0_668

CiNii Research

複数の凸面鏡を持つ高度な硬X線結像光学系の開発（第一報）

松山智至, 波多健太郎, 山内和人

精密工学会学術講演会講演論文集 2021S 巻 ( 0 ) 頁： 672 - 672 2021年3月

記述言語：日本語出版者・発行元：公益社団法人精密工学会

4枚のミラーから成るAdvanced Kirkpatrick-Baezミラーは硬X線領域における有望な結像光学系である．我々は様々な光学系を実際に開発し，30nmの空間分解能を持つX線顕微鏡をすでに実現した．この光学系に複数の凸面鏡を組み入れることで，さらに高度な光学系が構築可能であることを見出した．本発表では，いくつかの設計例とシミュレーションを示し，結像特性について調査した結果を示す．

DOI： 10.11522/pscjspe.2021s.0_672

CiNii Research

結像型X線顕微鏡における波面計測手法の開発

田中優人, 松山智至, 井上陽登, 中村南美, 山田純平, 香村芳樹, 矢橋牧名, 表和彦, 石川哲也, 山内和人

精密工学会学術講演会講演論文集 2021S 巻 ( 0 ) 頁： 671 - 671 2021年3月

記述言語：日本語出版者・発行元：公益社団法人精密工学会

X線ミラーを用いた結像型X線顕微鏡は，色収差が無くスループットが高い点で優れているが，許容アライメント誤差が厳しく，高空間分解能画像を得るためには，拡大結像配置にて光学素子由来の波面収差を計測しなければならない．我々は，フレネルゾーンプレートの集光点を試料とし，その拡大像を複数枚取得した上で反復的位相回復計算を施すことで波面を計測した．本手法を用いてアライメントを調整し，空間分解能23 nmを達成した．

DOI： 10.11522/pscjspe.2021s.0_671

CiNii Research

High-speed etching of silicon carbide wafer using high-pressure SF6 plasma

Yasuhisa Sano, Koki Tajiri, Yuki Inoue, Risa Mukai, Yuma Nakanishi, Satoshi Matsuyama, Kazuto Yamauchi

ECS Journal of Solid State Science and Technology 10 巻 ( 1 ) 2021年1月

掲載種別：研究論文（学術雑誌）

Semiconductor silicon carbide (SiC) is proposed to be a promising material for power-saving devices. However, due to its hard and brittle properties, there is a need to develop a highly efficient strain-free thinning process for the backside thinning of vertical power transistors. As a method for thinning SiC wafers without crystallographic damages, plasma etching with high-pressure SF6 plasma was proposed and the dependence of different processing parameters on the removal rate was investigated. The results revealed that the removal rate was mainly influenced by the power density and relatively insensitive to processing parameters such as processing gap and gas flow rate. It was discovered that a high-speed etching of the entire surface of a commercially available 2- inch wafer at approximately 15 μm min-1 can be achieved by increasing the radio frequency power. Additionally, it was demonstrated that the thickness of the 2-inch wafer can be thinned to approximately 100 μm by only 20 min plasma etching.

DOI： 10.1149/2162-8777/abdc47

Scopus

Development of precision Wolter mirrors towards PhoENiX mission for the Sun

Taro Sakao, Satoshi Matsuyama, Jumpei Yamada, Takato Inoue, Kentaro Hata, Hiroyuki Yamaguchi, Taku Hagiwara, Nami Nakamura, Kazuto Yamauchi, Yoshiki Kohmura, Yoshinori Suematsu, Noriyuki Narukage

Space Telescopes and Instrumentation 2020: Ultraviolet to Gamma Ray 2020年12月

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