Award type：International academic award (Japan or overseas)  Country：United States

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We investigated the hole mobility limiting factors in dopant-free p-type distributed polarization-doped (DPD) AlGaN layers by an experimental method. p-DPD AlGaN exhibited a higher hole mobility than GaN:Mg with a similar room temperature hole concentration across all temperature ranges owing to the absence of ionized impurity scattering. In addition, unlike in n-DPD AlGaN, alloy scattering was not always critical in p-DPD AlGaN. The extracted alloy scattering potential was only 0.3 eV, which resulted in a reduced effect of alloy scattering and originated from a small valence band offset in the GaN/AlN heterojunction system. The results suggest that DPD principally enables the fabrication of low-resistance p-type nitride semiconductor thin films as a result of the high hole concentration and high hole mobility.

DOI： 10.1063/5.0155363

Web of Science

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We demonstrate high, up to 30% In content InGaN sub-micrometer platelets on GaN by metalorganic vapor phase epitaxy. These InGaN platelets were selectively grown on flat GaN seeds formed in sub-micrometer-scale openings in a SiNx mask. The platelets were highly uniform without any dislocations or pits, with an atomically flat (0001) surface. The typical height was ∼120 nm, which significantly exceeded the normal critical layer thickness of a c-plane InGaN film. The strain state was comprehensively characterized by microbeam x-ray diffraction and transmission electron microscopy. Due to a gradual elastic relaxation of strain, the In content increased almost linearly from bottom to top because of the strong strain-dependent In incorporation. These platelets can serve as high-quality strain-relaxed templates for long wavelength micro-light-emitting diodes.

DOI： 10.1063/5.0120723

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Applied Physics  

The precise control of Mg concentration ([Mg]) in p-type GaN layers from 2.3 × 1016 to 2.0 × 1019 cm-3 was demonstrated by halide vapor phase epitaxy (HVPE) on n-type GaN (0001) freestanding substrates. [Mg] in GaN layers could be controlled well by varying the input partial pressure of MgCl2 formed by a chemical reaction between MgO solid and HCl gas under the thermodynamic equilibrium condition. In the sample with [Mg] of 2.0 × 1019 cm-3, a step-bunched surface was observed because the surface migration of Ga adatoms was enhanced by the surfactant effect of Mg atoms. The samples show high structural qualities determined from x-ray rocking curve measurements. The acceptor concentration was in good agreement with [Mg], indicating that almost all Mg atoms act as acceptors. The compensating donor concentrations in the samples were higher than the concentrations of Si, O, and C impurities. We also obtained the Mg acceptor level at a sufficiently low net acceptor concentration of 245 ± 2 meV. These results show that the HVPE method is promising for fabricating GaN vertical power devices, such as n-channel metal-oxide-semiconductor field-effect transistors.

DOI： 10.1063/5.0122292

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Scientific Reports  

As a newly developed technique to slice GaN substrates, which are currently very expensive, with less loss, we previously reported a laser slicing technique in this journal. In the previous report, from the perspective of GaN substrate processing, we could only show that the GaN substrate could be sliced by a laser and that the sliced GaN substrate could be reused. In this study, we newly investigated the applicability of this method as a device fabrication process. We demonstrated the thinning of GaN-on-GaN high-electron-mobility transistors (HEMTs) using a laser slicing technique. Even when the HEMTs were thinned by laser slicing to a thickness of 50 mm after completing the fabrication process, no significant fracture was observed in these devices, and no adverse effects of laser-induced damage were observed on electrical characteristics. This means that the laser slicing process can be applied even after device fabrication. It can also be used as a completely new semiconductor process for fabricating thin devices with thicknesses on the order of 10 mm, while significantly reducing the consumption of GaN substrates.

DOI： 10.1038/s41598-022-10610-4

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PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

We demonstrated continuous-wave lasing of an AlGaN-based ultraviolet laser diode, fabricated on a single-crystal AlN substrate when operating at 5 °C. The threshold current density and device series resistance were reduced by improvements to the epitaxial structure and electrode arrangement. A peak wavelength of 274.8 nm was observed for lasing at a drive current over 110 mA, which corresponded to a threshold current density of 3.7 kA cm-2. The operating voltage at the threshold current was as low as 9.6 V.

DOI： 10.35848/1882-0786/ac6198

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We have demonstrated a fabrication process for the Ohmic contact on low-doping-density p-type GaN with nitrogen-annealed Mg. An Ohmic contact with a contact resistance of 0.158 ω cm2 is realized on p-GaN ([Mg] = 1.3 × 1017 cm-3). The contact resistance of p-type GaN with higher Mg concentration ([Mg]=1.0 × 1019 cm-3) can also be reduced to 2.8 × 10-5 ω cm2. A localized contact layer is realized without any etching or regrowth damage. The mechanism underlying this reduced contact resistance is studied by scanning transmission electron microscopy with energy dispersive x-ray spectroscopy and secondary ion mass spectrometry, representing a mutual diffusion of Ga and Mg atoms on the interface. Reductions in the barrier height and surface depletion width with the nitrogen-annealed Mg layer are confirmed by XPS and Hall effect measurements qualitatively.

DOI： 10.1063/5.0076764

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Scientific Reports  

We have investigated the possibility of applying lasers to slice GaN substrates. Using a sub-nanosecond laser with a wavelength of 532 nm, we succeeded in slicing GaN substrates. In the laser slicing method used in this study, there was almost no kerf loss, and the thickness of the layer damaged by laser slicing was about 40 µm. We demonstrated that a standard high quality homoepitaxial layer can be grown on the sliced surface after removing the damaged layer by polishing.

DOI： 10.1038/s41598-021-97159-w

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PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Vacuum Science and Technology B  

The dependence of the quantum efficiency (QE) of a Cs/O-activated negative-electron-affinity (NEA) state InGaN photocathode on threading dislocation density (TDD) was investigated. InGaN photocathodes with different TDDs were grown on sapphire and GaN substrates by metal-organic vapor-phase epitaxy (MOVPE). The TDDs were 1 × 109 cm−2 on the sapphire substrate and less than 5 × 106 cm−2 on the GaN substrate. After the activation of the NEA state of InGaN photocathode surfaces by Cs/O, the QEs were 1.1% on the sapphire substrate and 0.91% on the GaN substrate. Despite a TDD difference of approximately two orders of magnitude, the QEs were comparable. The results show that the QE is not limited by the high TDD in the InGaN photocathode.

DOI： 10.1116/6.0004199

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Physica Status Solidi (B): Basic Research  

Quaternary AlGaInN has attracted attention because its physical properties such as bandgap, polarization, and lattice constant can be independently changed by controlling the AlN, GaN, and InN mole fractions. However, the complexity of crystal growth is problematic, and reducing unintentionally incorporated impurities that cause carrier scattering and compensation is crucial. In this study, about 30-nm-thick AlxGa1−(x+y)InyN (x ≈ 0.5 and y ≤ 0.12) is grown on GaN on sapphire by metalorganic vapor phase epitaxy under various growth conditions to systematically analyze the relationship between growth conditions and oxygen and carbon concentrations ([O] and [C], respectively) as well as surface morphology and to elucidate the factors affecting [O] and [C]. [O] is decreased in samples grown at low growth rates and high growth temperatures. This can be attributed to the realization of a smooth surface morphology free of V-pits and trench defects. [C] is decreased in samples grown at a low total of group III source flow rates. The [C] of UID-GaN and that of AlGaInN at various TMI flow rates suggest that TMA mainly affects [C]. Therefore, the key to impurity reduction is to obtain a smooth surface morphology and to promote the adequate decomposition of TMA.

DOI： 10.1002/pssb.202500028

Open Access

Web of Science

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

GaN p-n diodes were fabricated by contactless photo-electrochemical (PEC) etching, and their electrical characteristics were evaluated. A high vertical etching rate of 80 nm min−1, which is usable for device fabrication etching processes, was achieved using a H₃PO₄ based electrolyte containing S₂O₈2⁻ ions and intense UV light. The sidewalls after etching were perpendicular to the substrate owing to the directivity of UV light. Vertical GaN p-n diodes with deeply etched mesas were fabricated by contactless PEC etching and avalanche breakdown was confirmed. The results point to an alternative method of fabricating high-performance GaN power devices.

DOI： 10.35848/1882-0786/adbc43

Open Access

Web of Science

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1347-4065/adb256

Open Access

Web of Science

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

A vertical GaN p-n junction diode (PND) and junction barrier Schottky diode (JBSD) were fabricated by selective Mg diffusion. Mg was diffused from a shallow N/Mg ion-implantation segment to a depth of 800 nm with a concentration of 1 × 1017-3 × 1018 cm−3 by annealing with an AlN capping layer at 1300 ℃ for 5 min under atmospheric N2 pressure. The PND and JBSD exhibited specific on-resistances of 2.3-2.6 mΩ cm2 and repeatable breakdowns at 1.95 kV without degradation in breakdown voltage or leakage current. Additionally, the JBSD achieved a high-on/off ratio of 9.1 × 107 between 1.5 V and −1 kV.

DOI： 10.35848/1882-0786/ada71a

Open Access

Web of Science

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Physica Status Solidi (A) Applications and Materials Science  

An all-GaN-based monolithic active-matrix micro-LED system that integrates metal-insulator-semiconductor high-electron-mobility transistors (MIS HEMTs) with light-emitting diodes (LEDs) is demonstrated. The proposed structure employs direct electron injection from the 2D electron gas (2DEG) in a HEMT, serving as the n-type layer, into the quantum wells of the LEDs. A 2-HEMT-1-LED pixel configuration is fabricated with one epitaxial growth, enabling the precise control of LED light output through a combination of select and drive HEMTs. The fabricated pixel achieved a maximum optical output density of 0.5 Wcm−2. A 2 × 2 pixel matrix is constructed with row and column lines connected via select HEMTs, demonstrating the capability of the 2-HEMT-1-LED pixel configuration for individual LED control.

DOI： 10.1002/pssa.202500044

Open Access

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Physica Status Solidi - Rapid Research Letters  

This study aims to investigate the external quantum efficiency (EQE) of InGaN-based blue micro light-emitting diodes (μLEDs) depending on sidewall conditions and current stress. To this end, this study prepares two sets of InGaN blue μLEDs with sizes of 10 × 10 μm2, 20 × 20 μm2, and 40 × 40 μm2: 1) μLEDs with and without a 10 nm-thick ALD-SiO2 interlayer and 2) μLEDs with varying atomic layer deposition (ALD)-Al2O3 passivation layer thickness and tetramethylammonium hydroxide (TMAH) treatment time. The results of set 1 demonstrate that the ALD-SiO2 interlayer layer has a significant effect on the EQE of μLEDs only at low current densities, as the interlayer effectively protects against subsequent plasma damage. The results of current stress show that the ALD-SiO2 interlayer plays an important role at low current densities. The results of set 2 demonstrate that a sufficiently thick ALD passivation layer should be deposited to minimize sidewall interface states, and a short TMAH treatment time of 1 min is sufficient. The results in this study highlight that sidewall conditions have a substantial impact on the EQE at low current densities and indicate that optimizing ALD thickness and TMAH treatment time can reduce processing time and cost.

DOI： 10.1002/pssr.202500042

Open Access

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：IEEE Transactions on Semiconductor Manufacturing  

Achieving long-duration, large bulk GaN growth is crucial to supply low-cost, high-quality GaN. Halogen-free vapor phase epitaxy (HF-VPE) is a promising method for bulk GaN growth but faces challenges due to severe polycrystals deposition on reactor components, such as the source-gas nozzles, which impedes stable, extended growth. In this study, we developed models to simulate the polycrystal deposition in HF-VPE-GaN growth conditions by including surface reactions of GaN formation and NH3. decomposition. Moreover, we devised conditions for controlling gas flow and interdiffusion to suppress polycrystal deposition around the source-gas nozzles. Experimental results aligned with simulations, showing that increasing the distance between Ga and NH. nozzles and replacing the sheath gas from H2. to N2. effectively minimized polycrystal formation. The findings confirm that reducing NH3. concentration through catalytic surface decomposition on refractory components is crucial to polycrystal suppression. Optimizing nozzle dimensions and gas species synergistically controls the gas flow and interdiffusion. The constructed models contribute to advancing the design of polycrystal suppressive structures and conditions for long-duration bulk GaN growth.

DOI： 10.1109/TSM.2025.3558328

Open Access

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Crystal Growth  

Results of a thermodynamic study of Sn doping and fabrication of a Sn-doped GaN freestanding layer with high structural quality by halide vapor phase epitaxy (HVPE) are described in this paper. Thermodynamic analysis revealed that SnCl2 and/or SnCl act as Sn precursors through the reaction between Sn metal and HCl gas. The equilibrium partial pressures of SnCl2 and SnCl increase with the input HCl partial pressure. To generate Sn precursors effectively, it is desirable that the reaction between Sn metal and HCl gas occurs in the inert gas ambient. On the basis of results of the thermodynamic study, the Sn-doped GaN freestanding layer with a Sn concentration of 5.7 × 1019 cm−3 is fabricated by removing the GaN seed substrate after HVPE growth. The Sn-doped GaN freestanding layer has high crystal quality, and the lattice constants along the c- and a-axes of the Sn-doped GaN freestanding layer are larger than those of the GaN seed substrate because of the high electron density and the size effect of Sn atoms.

DOI： 10.1016/j.jcrysgro.2024.127923

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Reviews  

Herein, we investigate micro-light-emitting diodes (μLEDs) ranging in size from 160 × 160 to 10 × 10 μm2 and report that the differences in the behavior of InGaN-based blue (∼460 nm) and red (∼600 nm) μLEDs are related to carrier localization. The external quantum efficiency (EQE) of blue μLEDs decreases with size regardless of sidewall conditions, whereas that of red μLEDs is insignificant due to carrier localization. Atomic probe tomography examination of 30%, 15%, and 7.5% indium-concentrated InGaN layers used in red μLEDs shows that higher indium concentrations result in greater indium fluctuations, which promote carrier localization and thus shorten the diffusion length of carriers. Finally, by observing the peak wavelength of electroluminescence and the current density at peak EQE for both blue and red μLEDs, we find that radiative recombination rate in μLEDs is likely to be chip size dependent.

DOI： 10.1063/5.0195261

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Reviews  

The evolution of power and radiofrequency electronics enters a new era with (ultra)wide bandgap semiconductors such as GaN, SiC, and β-Ga2O3, driving significant advancements across various technologies. The elevated breakdown voltage and minimal on-resistance result in size-compact and energy-efficient devices. However, effective thermal management poses a critical challenge, particularly when pushing devices to operate at their electronic limits for maximum output power. To address these thermal hurdles, comprehensive studies into thermal conduction within semiconductor heterostructures are essential. This review offers a comprehensive overview of recent progress in (ultra)wide bandgap semiconductor heterostructures dedicated to electronics cooling and are structured into four sections. Part 1 summarizes the material growth and thermal properties of (ultra)wide bandgap semiconductor heterostructures. Part 2 discusses heterogeneous integration techniques and thermal boundary conductance (TBC) of the bonded interfaces. Part 3 focuses on the research of TBC, including the progress in thermal characterization, experimental and theoretical enhancement, and the fundamental understanding of TBC. Parts 4 shifts the focus to electronic devices, presenting research on the cooling effects of these heterostructures through simulations and experiments. Finally, this review also identifies objectives, challenges, and potential avenues for future research. It aims to drive progress in electronics cooling through novel materials development, innovative integration techniques, new device designs, and advanced thermal characterization. Addressing these challenges and fostering continued progress hold the promise of realizing high-performance, high output power, and highly reliable electronics operating at the electronic limits.

DOI： 10.1063/5.0185305

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：ACS Applied Electronic Materials  

We report on the growth and characterization of semipolar (101̅3) InGaN/GaN light-emitting diodes (LEDs) on m-plane (101̅0) sapphire with high internal quantum efficiencies (IQEs). Based on earlier work on obtaining untwinned (101̅3) GaN templates on m-plane sapphire, we also succeeded in smoothing the relatively unstable (101̅3) surface using very low V/III ratios during metal-organic vapor phase epitaxy and in the growth of n-and p-doped layers to produce LEDs. Fitting the current-dependent emission, we found high IQEs, up to 86% at 460 nm. The IQEs decreased toward longer wavelengths, similar as for conventional Ga-polar (0001) oriented LEDs. However, the semipolar (101̅3) LEDs have their maximum IQE at much higher current densities than the polar (0001) LEDs due to the higher overlap between electron and hole wave function while maintaining a positive polarization. Together, this makes the (101̅3) orientation very attractive for future blue LEDs.

DOI： 10.1021/acsaelm.4c01312

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：日本結晶学会  

DOI： 10.5940/jcrsj.66.s2

Open Access

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Physica Status Solidi (A) Applications and Materials Science  

The degradation of an AlGaN-based deep-ultraviolet laser diode during operation is studied. A rapid increase in threshold current without any facet mirror damage under direct current stress below the threshold current is observed, which is considered to limit the lifetime of continuous wave lasing to the level of seconds. The evolution of current–light and current–voltage characteristics suggests that the dominant mechanism of degradation is the increased loss of carriers before they can reach the active layer, i.e., the decrease in carrier injection efficiency. The decrease in emission intensity, which is more pronounced at lower current densities, and subsequent increase in sub-threshold current indicate the increase in defect density under current stress, which is similar to the well-analyzed degradation mechanism found in AlGaN-based light-emitting diodes.

DOI： 10.1002/pssa.202300946

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

The gain characteristics of electrically injected AlGaN-based deep-ultraviolet laser diodes were studied with respect to their quantum-well (QW) width dependence by the analysis of the threshold currents and gains for various cavity lengths. Among the fabricated QWs with widths of d = 9, 4.5, and 3 nm, the QW with the smallest width of 3 nm was found to have the highest material gain and lowest transparency carrier density. In contrast to recent arguments in favor of wider QWs for deep-ultraviolet laser diodes, the strategy of narrowing QWs is still found to be effective in practical terms of reducing the threshold current density.

DOI： 10.1063/5.0240488

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We report on the growth of AlPN on GaN/sapphire templates by metalorganic vapor phase epitaxy using tertiarybutylphosphine (tBP) and NH3 as group-V precursors. P is easy to incorporate into the group-III lattice site, forming PAl anti-site defects and shrinking lattice constants that are even beyond AlN since Al is larger than P. We found that higher temperatures favor P incorporation on the N-sublattice, forming AlPyN1−y, while growth temperatures below 1000 °C result in dominant P incorporation on the Al-sublattice, forming PAl anisites. Similarly, larger NH3 flows stabilize GaN, leading to flat interfaces, but favor the formation of PAl. Furthermore, the P incorporation into AlPyN1−y is non-linear. At very low tBP flows, it initially increases to reach a maximum. Further increasing the tBP flow increases mostly the incorporation of P on the Al-sublattice, and the c-lattice constant decreases again. This leaves a small window of low V/III ratios below 5 and low P/N ratios of 1% or smaller, leading up to ∼4% P incorporation at typical growth temperatures of GaN. However, at such low V/III ratios, GaN is not stable even with N2 carrier gas and requires optimized switching sequences to minimize its decomposition and preserve flat interfaces. Eventually, a 10 nm coherent layer of AlP0.01N0.99 could be reproducibly grown on top of GaN channels with a smooth surface, an abrupt AlPN/GaN interface, and a two-dimensional electron gas with an electron mobility of ∼675 cm2/V s and a sheet carrier density of 1.5 × 1013 cm−2 at room temperature.

DOI： 10.1063/5.0225115

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

This Letter reports an investigation of hole transport in p-GaN/AlGaN/GaN heterostructures through experimental and theoretical analyses under varied conditions. Highly non-linear current-voltage (I-V) characteristics, obtained via the linear transmission line method measurements, are utilized for this study. At low bias voltage, the transport can be ascribed to the Schottky nature of the contact, while at high bias, the conduction is observed to be governed by space-charge limited current (SCLC). The Schottky characteristics (Schottky barrier height and non-ideality factor) and the SCLC exponent were analyzed for devices with varying contact spacings and at different high temperatures. The SCLC exponent, m, is in the range of 2 ≤ m ≤ 4 depending on the applied voltage range, revealing the existence of the trap states in the channel region. The findings of this work indicate that the charge injection, field-induced ionization, and trap states in the p-GaN channel are critical factors in the current transport of p-GaN/AlGaN/GaN heterostructure.

DOI： 10.1063/5.0203344

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Reviews  

Display technology has developed rapidly in recent years, with III-V system-based micro-light-emitting diodes (μLEDs) attracting attention as a means to overcome the physical limitations of current display systems related to their lifetime, brightness, contrast ratio, response time, and pixel size. However, for μLED displays to be successfully commercialized, their technical shortcomings need to be addressed. This review comprehensively discusses important issues associated with μLEDs, including the use of the ABC model for interpreting their behavior, size-dependent degradation mechanisms, methods for improving their efficiency, novel epitaxial structures, the development of red μLEDs, advanced transfer techniques for production, and the detection and repair of defects. Finally, industrial efforts to commercialize μLED displays are summarized. This review thus provides important insights into the potential realization of next-generation display systems based on μLEDs.

DOI： 10.1063/5.0177550

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Applied Physics  

For rooting the development of GaN-based optoelectronic devices, understanding the roles of midgap recombination centers (MGRCs), namely, nonradiative recombination centers and deep-state radiative recombination centers, on the carrier recombination dynamics is an essential task. By using the combination of time-resolved photoluminescence and positron annihilation spectroscopy (PAS) measurements, the origins of major MGRCs in the state-of-the-art GaN epilayers, bulk crystals, and Mg-implanted layers were identified, and their concentrations were quantified for deriving the capture coefficients of minority carriers. In this article, potential standardization of the room-temperature photoluminescence lifetime for the near-band-edge emission ( τ PL RT ) as the concentration of major MGRCs well below the detection limit of PAS is proposed. For n-GaN substrates and epilayers grown from the vapor phase, τ PL RT was limited by the concentration of carbon on N sites or divacancies comprising a Ga vacancy (VGa) and a N vacancy (VN), [VGaVN], when carbon concentration was higher or lower, respectively, than approximately 1016 cm−3. Here, carbon and VGaVN act as major deep-state radiative and nonradiative recombination centers, respectively, while major MGRCs in bulk GaN crystals were identified as VGa(VN)3 vacancy clusters in Na-flux GaN and VGa or VGaVN buried by a hydrogen and/or VGa decorated with oxygen on N sites, VGa(ON)3-4, in ammonothermal GaN. The values of τ PL RT in n-GaN samples are compared with those of p-GaN, in which τ PL RT was limited by the concentration of VGa(VN)2 in Mg-doped epilayers and by the concentrations of VGaVN and (VGaVN)3 in Mg-implanted GaN right after the implantation and after appropriate activation annealing, respectively.

DOI： 10.1063/5.0201931

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Physics Condensed Matter  

Metastability of Aln/12Ga1−n/12N (n = 2–10: integer) with the 1–2 monolayer (ML) in-plane configuration towards the c [0001] direction has been demonstrated recently. To theoretically explain the existence of these metastable structures, relatively large calculation cells are needed. However, previous calculations were limited to the use of small calculation cell sizes to estimate the local potential depth (∆σ) of ordered Al1/2Ga1/2N models. In this work, we were able to evaluate large calculation cells based on the interaction energies between proximate Al atoms (δEAl–Al) in AlGaN alloys. To do this, δEAl–Al values were estimated by first-principles calculations (FPCs) using a (5a1 × 5a2 × 5c) cell. Next, a survey of the possible ordered configurations using various large calculation cell models was performed using the estimated δEAl–Al values and the Monte-Carlo method. Then, various ∆σ values were estimated by FPCs and compared with the configurations previously reported by other research groups. We found that the ordered configuration obtained from the (4a1 × 2a2 × 1c) calculation cell (C42) has the lowest ∆σ of −9.3 meV/cation and exhibited an in-plane configuration at the c(0001) plane having (–Al–Al–Ga–Ga–) and (–Al–Ga–) sequence arrangements observed along the m{11̄00} planes. Hence, we found consistencies between the morphology obtained from experiment and the shape of the primitive cell based on our numerical calculations.

DOI： 10.1088/1361-648X/ad1137

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PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Japanese Journal of Applied Physics  

We investigated the C-related complexes in highly C-doped GaN by electron spin resonance (ESR) spectroscopy, Fourier transform IR spectroscopy (FTIR), and minority carrier transient spectroscopy (MCTS) measurements. In the ESR spectra, two resonances with g values of 2.02 and 2.04 were found to be assigned by (0/−) deep acceptor and (+/0) charge transition levels of carbon substituting for nitrogen site (CN). In the FTIR spectra, two local vibrational modes positioned at 1679 and 1718 cm−1 were confirmed to be associated with tri-carbon complexes of CN-CGa-CN (basal) and CN-CGa-CN (axial), respectively. In the MCTS spectra, we observed the hole trap level of E v + 0.25 ± 0.1 eV associated with the tri-carbon complexes, which are the dominant C-related defects, suggesting that these complexes affect the electronic properties in the highly C-doped GaN.

DOI： 10.35848/1347-4065/ad3b54

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：IEEE Transactions on Electron Devices  

In this work, we report a low-cost methodology to increase the barrier height of N-polar GaN Schottky diodes. Physical vapor deposition (PVD) of Mg followed by a thermal diffusion anneal at 800 °C leads to the formation of N-polar GaN Camel diode offering a larger barrier height than the conventional N-polar GaN Schottky diodes. The increase in barrier height after the Mg diffusion process is validated using current-voltage ({I} - {V}) and capacitance-voltage (CV) measurements. A barrier height of 0.7 eV and a near-unity ideality factor observed in the N-polar GaN Camel diode confirms that the proposed Mg diffusion process is an alternative method for improving the performance of future N-polar GaN diodes.

DOI： 10.1109/TED.2023.3341831

Web of Science

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Crystal Growth  

DOI： 10.1016/j.jcrysgro.2023.127552

Web of Science

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Crystal Growth  

A Sn-doped n-type GaN layer with a high electron density of 2 × 1020 cm−3 and a low resistivity of 8.7 × 10−4 Ω∙cm was grown by halide vapor phase epitaxy (HVPE). Sn doping was performed through the reaction between Sn metal and HCl gas. The Sn concentration markedly increased with decreasing growth temperature and the activation energy of Sn desorption from the GaN surface was found to be 4.1 eV. Smooth surfaces were obtained by introducing the Sn precursor even though the samples were grown at a low temperature of 905 °C, suggesting that Sn atoms act as surfactants and promote the migration of Ga adatoms. Almost all the Sn atoms act as donors in GaN below the Sn concentration of 2 × 1020 cm−3. These results indicate that using the Sn donor is promising for fabricating low-resistivity n-type GaN substrates by HVPE.

DOI： 10.1016/j.jcrysgro.2023.127529

Web of Science

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

Increasing the injection efficiency, a critical factor constraining the reduction in threshold current in AlGaN-based deep-ultraviolet laser diodes, represents one of the paramount remaining technical challenges. In this study, the impact of compositionally graded layers that were unintentionally formed at the interface between the p-cladding and the core layer on carrier injection efficiency was analyzed. Experimental evaluations using laser diodes have shown that the elimination of an unintentionally formed layer increases the injection efficiency above the threshold current, from the conventional 3% to 13%. It has been postulated that the electron overflow toward the p-side exerts a substantial deleterious effect on the injection efficiency. An improvement in this aspect is achieved by increasing the electron-blocking capability due to the improved interface abruptness between the p-cladding layer and the core layer. The lasing threshold was strongly reduced, and characteristic temperature increased from 76 to 107 K for the improved devices.

DOI： 10.1063/5.0184543

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms  

Lanthanide (Ln)-implanted gallium nitride (GaN) semiconductors have a variety of potential applications as light-emitting devices and quantum light sources, but their optical properties are not well understood. In this study, we investigate the room temperature optical properties of praseodymium (Pr) ion implanted single-crystal GaN and their changes upon ultrahigh pressure annealing (UHPA) up to 1480 °C. Photoluminescence (PL) spectra, luminescence transition lifetime, and excitation cross section of the implanted Pr ions are analyzed. In addition, the recovery of implantation-induced damage and the thermal diffusion of implanted Pr ions by UHPA are investigated by X-ray diffraction, Raman spectroscopy, and secondary ion mass spectrometry. The results show that the implantation damage is recovered by annealing at temperatures above 1200 °C, but Pr ions thermally diffuse to the surface as the annealing temperature increases. The annealing temperature at which a maximum PL intensity is obtained increases with increasing the implantation dose. However, the PL intensity decreases in all cases after annealing at 1480 °C, indicating that a quenching factor is dominant in this temperature range.

DOI： 10.1016/j.nimb.2023.165181

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

The development of gallium nitride (GaN) vertical-type metal-oxide-semiconductor field-effect transistors and p-i-n diode devices has gathered increasing attention. These devices require an n-type drift layer with a low doping level of 1016 cm−3 or less, minimized point defects inhibiting electron conduction, and a layer approximately 10 μm thick. Therefore, a practical method with a growth rate of at least several tens of μm/h and impurity concentrations of less than 1015 cm−3, except for that of dopants, is necessary. Halogen-free vapor-phase epitaxy (HF-VPE) has a high growth rate suitable for fabricating thick drift layers and utilizes a simple reaction between Ga vapor and ammonia gas (without a corrosive halogen gas), resulting in lower impurity levels. Herein, we eliminated the quartz content from the high-temperature zone to reduce the excess unintentional Si doping and identified that the nitrile gloves used for the growth preparation are other impurity contamination sources. We obtained a lightly n-type ([Si]=∼1016 cm−3) GaN layer, in which C, O, B, Fe, Mg, Al, Ca, Cr, Zn, Ni, Mn, and Ti impurity contents were below the detection limits of secondary ion mass spectrometry. Deep-level transient spectroscopy revealed that electron traps at EC − 0.26 and at EC − 0.59 eV were 2.7 × 1013 and 5.2 × 1014 cm−3, respectively. Moreover, the Hall effect analysis showed the acceptor-type defect-compensating donor content as approximately 2.7 × 1015 cm−3, resulting in a high electron mobility of HF-VPE GaN in the 30-710 K temperature range. Furthermore, we identified the Ca impurity as a deep acceptor, another killer defect leading to mobility collapse.

DOI： 10.1063/5.0191774

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Semiconductor Science and Technology  

In this letter, we investigate the impact of periphery, width, length and area on the external quantum efficiency (EQE) of stripe-type InGaN-based red micro-light-emitting diodes (µLEDs). A longer periphery resulted in a higher light extraction efficiency ( η e ) via the sidewall regardless of the area of the µLEDs. However, as the injection current increased a somewhat larger efficiency droop was observed at the longer periphery due to current crowding. Additionally, larger µLEDs experienced more self-heating than smaller ones, resulting in a red shift of wavelengths and a larger efficiency droop. When the current density exceeded 100 A cm−2, the EQE ratio of smaller-area μLEDs to larger-area ones increased significantly due to the difference in efficiency droop. Besides, a short light propagation length and a long emission width yielded a higher η e . Hence, the periphery, width, length and area of the µLEDs determine EQE, which provides insight into the pixel design of µLED displays.

DOI： 10.1088/1361-6641/ad0b88

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Sensors and Materials  

Group-III nitride semiconductors, such as gallium nitride (GaN), have been proposed as novel materials for radiation detection owing to their wide bandgap and their ability to operate at high temperatures. In this study, the radiation detection properties of GaN PIN diode detectors were evaluated at high temperatures (~573 K). The energy spectrum peak profiles of241Am α-particles were obtained at different temperatures, confirming the operation of GaN PIN diodes up to 573 K. The peak positions shifted toward the lower-energy side and the full width at half maximum (FWHM) of the detection energy peak improved with increasing temperature. Furthermore, the variation in electron carrier mobility–lifetime product (μeτe) between 293 and 573 K was not significant. These results indicate the potential high-temperature operation of group-III nitride semiconductors. Additionally, the variation in each detection characteristic was caused by increasing the atmospheric temperature, which affected the mobility, lattice scattering, bandgap, and built-in potential differently.

DOI： 10.18494/SAM4647

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：ACS Photonics  

Neuromorphic computing, inspired by biological synapses, has emerged as a pivotal approach to overcome the limitations of von Neumann architecture. In this work, we employ a three-terminal III-nitride metal-oxide-semiconductor field-effect transistor (MOSFET) structure based on the GaN-on-silicon platform, characterized by ultralow power consumption, to emulate artificial synapses through light stimulation. Remarkably, our device exhibits a minimal power consumption of 7 fJ per synaptic event, surpassing that of biological synapses (∼10 fJ). Notably, we observe that the paired pulse facilitation (PPF) index can be modulated by the external light intensity, pulse width, and light pulse interval. By manipulating the light intensity and pulse width, we achieve a PPF index exceeding 300% in our device. Furthermore, our devices demonstrate gate-tunable synaptic plasticity, enabling electric/light cooperative control and increasing the tuning freedom. Finally, acceleration of photopic adaption and a 91.28% handwritten digit recognition accuracy are achieved, which provide strong support in potential visual sensory applications.

DOI： 10.1021/acsphotonics.4c01038

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

Observation of high aspect ratio (HAR) structures is a difficult challenge in metrology and inspection in semiconductor manufacturing. In imaging HAR trenches using a scanning electron microscope (SEM), obtaining SEM images without information loss due to whiteouts and blackouts is challenging. One reason for the difficulty is that the probe current is constant in conventional SEM imaging. Suppose the probe current is increased to detect more secondary electrons from the bottom of the trench. In that case, excessive secondary electron emission from the top of the trench will result in a whiteout. The SEM equipped with a photocathode electron gun (PC-SEM) can change the probe current on a pixel-by-pixel basis by applying a pulsed electron beam. In this study, we propose two methods of SEM observation for HAR trenches. The first method uses a lower probe current at the top of the trench and a higher probe current at the bottom. With this method, the top and bottom of the trench could be observed simultaneously without any whiteout or blackout. Another method is to adjust the probe current so that the SEM image is in a constant grayscale. In this case, information about the sample appears in the probe current. The image of the probe current captured the trench bottom more clearly than the conventional SEM image under equivalent conditions.

DOI： 10.1117/12.3010733

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

Semiconductor photocathodes are electron beam sources with versatile electron beam performance such as pulsed structure as well as high beam current with high monochromaticity. Photocathode using GaN semiconductor material has solved the durability problem, resulting in the development of a compact photocathode electron gun suitable for industrial technology. The photocathode electron gun can be retrofitted to existing electron microscopes, has the same brightness as a cold field emitter cathode, and the pulsed beam not only brings selective beam irradiation to arbitrary area in the field of view in SEM imaging, but also allows blur-free TEM imaging of moving samples.

DOI： 10.1117/12.3010730

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

Scanning electron microscopy (SEM) is used for metrology and inspection in semiconductor manufacturing. In addition, electrical defects such as short circuits and unintentional insulation appear as contrast differences called voltage contrast (VC) in SEM under low acceleration voltage conditions. Moreover, by using pulsed electron beams from a photocathode, the probe current can be arbitrarily changed by pixel in the SEM image. Using this technology, we succeeded in observing the change in the VC of the drain in the metal-oxide-semiconductor field effect transistor (MOSFET) by changing in electron beam irradiation on the gate only. In this study, to estimate the threshold voltage of n-type MOSFET (nMOS) from VC, we investigated quantitative changes in the specimen current of the drain (Id) and the gate (Ig) due to gate e-beam irradiation ON/OFF during SEM imaging. The landing energy of the electron beam was set to 0.8 keV, the probe current was 6.3 pA, and the e-beam was irradiated onto only the gate and drain electrodes. Id and Ig, which showed a positive value at the beginning, decreased with time, and saturated at negative values. When the electron beam irradiation to the gate was turned OFF, the Id decreased further and reached saturation. When the gate e-beam irradiation was turned ON again, Ig recovered to a positive and then saturated again to a negative value. On the other hand, the drain Id increased when the gate irradiation was turned ON and returned to the same value as before it was turned OFF.

DOI： 10.1117/12.3009947

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Applied Physics  

The anisotropic hole transport along [0001] and [1120] in the p-doped (1010) GaN layer was compared for layers grown on bulk (1010) GaN substrates and on (1010) sapphire. The sheet resistance along [0001] was 1.1 times larger on GaN substrates and even 1.2 times larger on sapphire than that along [1120]. The anisotropic hole transport on bulk GaN substrates is due to the anisotropy of the hole’s effective mass and the different contribution of carriers in different bands, whereas the larger anisotropy for GaN on sapphire is also due to additional scattering at stacking faults. The annealing process of metal Mg applied to the m-plane p-type GaN successfully results in a robust p-type ohmic contact, functioning as a p++ layer.

DOI： 10.1063/5.0177681

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

Minority carrier properties in dopant-free p-type distributed polarization doped (DPD) AlGaN layers were investigated on the basis of the forward-biased current density-voltage (J-V) characteristics of p-n+ diodes. The fabricated p-DPD AlGaN/n+-AlGaN:Si diodes exhibited ideal electrical characteristics despite the absence of acceptor atoms in the p-type layer. The extracted Shockley-Read-Hall lifetime exceeded 300 ps, which was longer than that reported for p-GaN:Mg on GaN substrates with a similar acceptor concentration (20-50 ps). Moreover, the electron diffusion coefficient was about 20 cm2 s−1 at any temperature, which was convincing in terms of the electron mobility in DPD layers. The results suggest that p-DPD AlGaN has more desirable minority carrier properties than conventional p-GaN:Mg, particularly for bipolar device applications.

DOI： 10.1063/5.0180062

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

In this letter, we show that low-cost physical vapor deposition of Mg followed by a thermal diffusion annealing process increases the effective barrier height at the metal/Ga-polar GaN Schottky interface. Thus, for the first time, GaN Camel diodes with improved barrier height and turn-on voltage were realized compared to regular GaN Schottky barrier diodes. Temperature-dependent current-voltage characteristics indicated a near-homogeneous and near-ideal behavior of the GaN Camel diode. The analysis performed in this work is thought to be promising for improving the performance of future GaN-based unipolar diodes.

DOI： 10.35848/1882-0786/ad0db9

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

One approach to improving the output power of ultraviolet (UV-C) light-emitting diodes (LEDs) is to adopt an electron-blocking layer (EBL) with a high barrier. However, the intended effect may not be realized because of the composition pulling effect, which is the unintended occurrence of a gradient layer at an AlGaN/AlGaN hetero-interface with substantial differences in the Al composition. Here, we demonstrate that low-temperature growth (i.e., <1000 °C) can be used to control the unintentional gradient layer at an AlN/AlGaN hetero-interface between a barrier layer and AlN-EBL with a difference in Al compositions of more than 30%. LEDs with an emission wavelength of 265 nm were fabricated, and an AlN-EBL was grown at low temperature to realize an abrupt interface. At an applied current of 100 mA, growing the EBL under low-temperature conditions improved the forward voltage by 0.5 V and remarkably improved the peak luminous intensity by 1.4-1.6 times. Our results can be used to realize UV-C LEDs with a steep EBL and further improve their device characteristics.

DOI： 10.1063/5.0183320

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Optics Letters  

III-nitride optoelectronic chips have tremendous potential for developing integrated computing and communication systems with low power consumption. The monolithic, top–down approaches are advantageous for simplifying the fabrication process and reducing the corresponding manufacturing cost. Herein, an ultraviolet optical interconnection system is investigated to discover the way of multiplexing between emission and absorption modulations on a monolithic optoelectronic chip. All on-chip components, the transmitter, monitor, waveguide, modulator, and receiver, share the same quantum well structure. As an example, two bias-controlled modulation modes are used to modulate video and audio signals in the experiment presented in this Letter. The results show that our on-chip optoelectronic system works efficiently in the near ultraviolet band, revealing the potential breadth of GaN optoelectronic integration.

DOI： 10.1364/OL.503429

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Scopus

PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Laser and Photonics Reviews  

Nonradiative recombination rate that consists of dislocation-related nonradiative recombination rate (A0) and surface recombination rate (As) is one of the major parameters determining the performance of microlight-emitting diodes (µLEDs). Recent demonstrations improving the efficiency of blue InGaN or red AlGaInP µLEDs using specific methods such as atomic layer deposition or chemical treatment confirm the suppression of As. However, it is hardly found that those methods effectively improve the efficiency of red InGaN µLEDs so far. Here, it is discovered that the dislocation leads to an ineffective As. First, an intrinsic As degrades the external quantum efficiency (EQE) of blue InGaN µLEDs, resulting in EQE decreases with shrinking size. Second, panchromatic cathodoluminescence finds evidence that most of the carriers can be trapped before reaching the sidewall due to high A0. This results in shortened diffusion length of carriers and reduces the number of carriers reaching the sidewall. Consequently, the opposite trend of increasing EQE with shrinking size occurs in the case of red InGaN µLEDs due to an ineffective As. Furthermore, an 8.3 nm quantum well of InGaN with 13% Indium content that can reach a ≈690 nm wavelength at the low current is shown.

DOI： 10.1002/lpor.202300199

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

DOI： 10.1063/5.0174270

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We attempted to grow (10-13) semi-polar GaN on graphene to confirm the possibility of a remote epitaxy of semi-polar GaN. Single crystalline (10-13) GaN was obtained on an optimized template using optimized growth conditions. However, (10-13), (0002), and other GaN orientations were found under the same growth conditions on a graphene-coated template. Scanning transmission electron microscopy and energy-dispersive x-ray spectroscopy revealed that multi-domain GaN and (0002) GaN occurred in areas with a damaged graphene interfacial layer and intact graphene, respectively. Raman spectroscopy confirmed that graphene could survive under the growth conditions used here. Using cross-sectional scanning electron microscopy, we propose a simple approach to distinguish damaged graphene. Although the remote epitaxy of semi-polar GaN has not been demonstrated despite the usage of an optimized template and growth conditions, our results confirm the importance of the interfacial state in determining the crystallinity of the overgrown layer.

DOI： 10.1063/5.0157588

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Physica Status Solidi (A) Applications and Materials Science  

AlN-based field-effect transistors (FETs) enable high-breakdown voltage, high drain current, and high-temperature operation. To realize high-frequency devices, N-polar AlGaN/AlN heterostructure FETs are focused on. N-polar Al0.1Ga0.9N/Al0.9Ga0.1N/AlN FET is fabricated using metal–organic vapor-phase epitaxy, and its electrical characteristics are evaluated. An N-polar AlN layer is grown on a sapphire substrate with a misorientation angle of 2.0° toward m-axis, on which a 20 nm thick Al0.9Ga0.1N base layer and a 20 nm Al0.1Ga0.9N channel layer are grown. The static FET operation is confirmed to exhibit an n-channel and pinch-off. Normally, during operation with a turn-on voltage of −3.2 V, a high operating breakdown voltage of 620 V and high operating temperature of 280 °C are also confirmed.

DOI： 10.1002/pssa.202200871

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Environment International  

A non-filter virus inactivation unit was developed that can control the irradiation dose of aerosolized viruses by controlling the lighting pattern of a 280 nm deep-UV (DUV)-LED and the air flowrate. In this study, the inactivation properties of aerosolized SARS-CoV-2 were quantitatively evaluated by controlling the irradiation dose to the virus inside the inactivation unit. The RNA concentration of SARS-CoV-2 remained constant when the total irradiation dose of DUV irradiation to the virus exceeded 16.5 mJ/cm2. This observation suggests that RNA damage may occur in regions below the detection threshold of RT-qPCR assay. However, when the total irradiation dose was less than 16.5 mJ/cm2, the RNA concentration monotonically increased with a decreasing LED irradiation dose. However, the nucleocapsid protein concentration of SARS-CoV-2 was not predominantly dependent on the LED irradiation dose. The plaque assay showed that 99.16% of the virus was inactivated at 8.1 mJ/cm2 of irradiation, and no virus was detected at 12.2 mJ/cm2 of irradiation, resulting in a 99.89% virus inactivation rate. Thus, an irradiation dose of 23% of the maximal irradiation capacity of the virus inactivation unit can activate more than 99% of SARS-CoV-2. These findings are expected to enhance versatility in various applications. The downsizing achieved in our study renders the technology apt for installation in narrow spaces, while the enhanced flowrates establish its viability for implementation in larger facilities.

DOI： 10.1016/j.envint.2023.108022

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Scopus

PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Applied Physics  

The stress relaxation with increasing thickness of metal-organic vapor phase epitaxy grown Al0.19Ga0.81N on quasi-bulk (101 ¯0) m-plane GaN substrates was investigated by x-ray diffraction. The anisotropic in-plane stress leads to an orthorhombic distortion of the lattice, which requires special mathematical treatment. Extending earlier works, we developed a method to calculate the distortion along [12 ¯10], [0001], and [101 ¯0] and obtained the lattice parameters, Al content, and strain values. The stress relaxation along the two in-plane directions involves two different mechanisms. First, the stress along [12 ¯10] relaxes by the onset of misfit dislocations through the { 10 1 ¯ 0 } ⟨ 1 2 ¯ 10 ⟩ slip system while for thicker layers the stress along [0001] relaxes by crack formation. Comparing the cathodoluminescence emission at room temperature with the expected bandgap showed that both tensile in-plane strains along [12 ¯10] and [0001] decrease the bandgap.

DOI： 10.1063/5.0149838

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Advanced Optical Materials  

The sidewall condition is a key factor determining the performance of micro-light emitting diodes (µLEDs). In this study, equilateral triangular III-nitride blue µLEDs are prepared with exclusively m-plane sidewall surfaces to confirm the impact of sidewall conditions. It is found that inductively coupled plasma-reactive ion etching (ICP-RIE) causes surface damages to the sidewall and results in rough surface morphology. As confirmed by time-resolved photoluminescence (TRPL) and X-ray photoemission spectroscopy (XPS), tetramethylammonium hydroxide (TMAH) eliminates the etching damage and flattens the sidewall surface. After ICP-RIE, 100 µm2-µLEDs yield higher external quantum efficiency (EQE) than 400 µm2-µLEDs. However, after TMAH treatment, the peak EQE of 400 µm2-µLEDs increases by ≈10% in the low current regime, whereas that of 100 µm2-µLEDs slightly decreases by ≈3%. The EQE of the 100 µm2-µLEDs decreases after TMAH treatment although the internal quantum efficiency (IQE) increases. Further, the IQE of the 100 µm2-µLEDs before and after TMAH treatment is insignificant at temperatures below 150 K, above which it becomes considerable. Based on PL, XPS, scanning transmission electron microscopy, and scanning electron microscopy results, mechanisms for the size dependence of the EQE of µLEDs are explained in terms of non-radiative recombination rate and light extraction.

DOI： 10.1002/adom.202203128

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We have demonstrated the fabrication process for a lateral p-type Schottky barrier diode (SBD) with the annealed Mg ohmic contact layer on a MOVPE-grown p-GaN wafer and measured the electrical characteristic of the diode. Because of the selective-area ohmic contact, the interface between the Schottky electrode and p-type GaN is well protected from any damage introduced by dry-etching or regrowth. The ideality factor of the forward current-voltage characteristic is as low as 1.09 at room temperature and an on-off ratio above 109 is also achieved. Various metals are deposited as the Schottky electrode and the work function dependence of the Schottky barrier height is confirmed with a pinning factor of 0.58. The temperature dependence of the current-voltage characteristic indicates that the GaN p-type SBD still fits the thermionic emission mode at 600 K with an ideality factor of 1.1. The reverse current of the p-SBD is also studied with the Poole-Frenkel emission model, and the trap energy level in the p-GaN is confirmed.

DOI： 10.1063/5.0146080

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：AIP Advances  

When a quantum well (QW) diode is biased with a forward voltage and illuminated with an external shorter-wavelength light, the device simultaneously emits and detects light, with the injected current and the induced current mixed inside the wells. Separating these superimposed and dynamic electrical signals is useful for the development of multifunctional displays that can simultaneously transmit and receive light signals. By utilizing the unique overlap between the electroluminescence and detection spectra, we establish a wireless optical communication system using two AlGaInP diodes that have identical QW structures. The communication distance is 25 m, with one diode functioning as the transmitter and the other as the receiver. In particular, at the receiver end, the QW diode demonstrates simultaneous light emission and reception ability, and the mixed signals can be efficiently extracted, suggesting great potential for applications from light communication to advanced displays.

DOI： 10.1063/5.0142093

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.3390/nano13061077

PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Crystals  

Conventional deep-ultraviolet (UV) light-emitting diodes (LEDs) based on AlGaN crystals have extremely low light-emission efficiencies due to the absorption in p-type GaN anode contacts. UV-light-transparent anode structures are considered as one of the solutions to increase a light output power. To this end, the present study focuses on developing a transparent AlGaN homoepitaxial tunnel junction (TJ) as the anode of a deep-UV LED. Deep-UV LEDs composed of n+/p+-type AlGaN TJs were fabricated under the growth condition that reduced the carrier compensation in the n+-type AlGaN layers. The developed deep-UV LED achieved an operating voltage of 10.8 V under a direct current (DC) operation of 63 A cm−2, which is one of the lowest values among devices composed of AlGaN tunnel homojunctions. In addition, magnesium zinc oxide (MgZnO)/Al reflective electrodes were fabricated to enhance the output power of the AlGaN homoepitaxial TJ LED. The output power was increased to 57.3 mW under a 63 A cm−2 DC operation, which was 1.7 times higher than that achieved using the conventional Ti/Al electrodes. The combination of the AlGaN-based TJ and MgZnO/Al reflective contact allows further improvement of the light output power. This study confirms that the AlGaN TJ is a promising UV-transmittance structure that can achieve a high light-extraction efficiency.

DOI： 10.3390/cryst13030524

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Materials  

With the ammonothermal method, one of the most promising technologies for scalable, cost-effective production of bulk single crystals of the wide bandgap semiconductor GaN is investigated. Specifically, etch-back and growth conditions, as well as the transition from the former to the latter, are studied using a 2D axis symmetrical numerical model. In addition, experimental crystal growth results are analyzed in terms of etch-back and crystal growth rates as a function of vertical seed position. The numerical results of internal process conditions are discussed. Variations along the vertical axis of the autoclave are analyzed using both numerical and experimental data. During the transition from quasi-stable conditions of the dissolution stage (etch-back process) to quasi-stable conditions of the growth stage, significant temperature differences of 20 K to 70 K (depending on vertical position) occur temporarily between the crystals and the surrounding fluid. These lead to maximum rates of seed temperature change of 2.5 K/min to 1.2 K/min depending on vertical position. Based on temperature differences between seeds, fluid, and autoclave wall upon the end of the set temperature inversion process, deposition of GaN is expected to be favored on the bottom seed. The temporarily observed differences between the mean temperature of each crystal and its fluid surrounding diminish about 2 h after reaching constant set temperatures imposed at the outer autoclave wall, whereas approximately quasi-stable conditions are reached about 3 h after reaching constant set temperatures. Short-term fluctuations in temperature are mostly due to fluctuations in velocity magnitude, usually with only minor variations in the flow direction.

DOI： 10.3390/ma16052016

Scopus

PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Japanese Journal of Applied Physics  

We demonstrated nanoplatelet In x Ga1−x N pseudosubstrates with In content varying from 0 to 0.3 on low-dislocation-density GaN substrates. These nanoplatelets efficiently relax in-plane strain, thus allowing for the use of a thick active layer to reduce built-in polarization. The 15 nm thick InGaN active layers grown under the same conditions on these nanoplatelets showed a remarkable cathodoluminescence redshift from 460 to 617 nm, suggesting enhanced In incorporation efficiency in InGaN nanoplatelets with higher In content. Moreover, the 617 nm-emitting sample presented an imperceptible blueshift under excitation-power-dependent photoluminescence, indicating a weak polarization field introduced by the high-In-content pseudosubstrates and the thick active layer.

DOI： 10.35848/1347-4065/acb74c

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japan Society of Mechanical Engineers  

<p>An electrostatic precipitator suitable for the collection of aerosol-sized particles is developed. This device is a two-stage electrostatic precipitator divided into a corona discharge part and a collection electrode part. Positive ion is charged to the virus particles by corona discharge, and the negative pole of the collection electrode installed in the later stage collects these particles. The particle collection performance of the system is investigated when the inlet velocity (inlet flowrate) is varied. As a result, even at the same inlet velocity, the collection rate increased with smaller particle size. Furthermore, the collection efficiency of particles decreased with increasing flow velocity.</p>

DOI： 10.1299/jsmemecj.2023.s054-05

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japan Society of Mechanical Engineers  

<p>One of the crucial challenges in GaN epitaxial growth by metalorganic vapor phase epitaxy (MOVPE) method is the control of carbon (C) incorporation, which affects the resistivity of the individual layer of high-power and high-frequency devices based on GaN. Incorporating C into the GaN epilayer depends on various process parameters, such as growth temperature, pressure, carrier gas, flow rates of source gases, and reactor type. To determine the process parameters that control incorporated C concentration and uniformity, we have developed a novel numerical model for C incorporation into the grown GaN epilayer using MOVPE method. The developed model considers C incorporation through the decomposition of Ga source gas. We have implemented this model in a commercial crystal growth simulator, Virtual Reactor Nitride Edition, developed by STR. This study used experimental data to evaluate the dependence of temperature, growth rate, and V/III ratio of C incorporation predicted by the simulations. These results showed a strong correlation between the C concentration and these parameters, and good agreement with the experimental data.</p>

DOI： 10.1299/jsmecmd.2023.36.os-1406

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Physica Status Solidi (A) Applications and Materials Science  

The metal stop laser drilling of GaN-on-GaN devices is demonstrated using a UV sub-nanosecond laser as a light source. By monitoring the Bremsstrahlung emission at the drilling point, metal stops with a precision higher than 1 μm are realized for vias with a depth of 100 μm. From in situ laser-induced breakdown spectroscopy measurements, it is shown that endpoint detection is realized with high signal-to-noise ratio owing to the difference in the emission process between the strongly excited semiconductor and the metal. Herein, a through-substrate electrode with a resistance of less than 5 mΩ on GaN-on-GaN high-electron-mobility transistor (HEMT) wafers is demonstrated. The fabrication of through-substrate electrodes by this technique provides a simple process that does not require lithography or other complex processes. This process is expected to be useful in the fabrication of future GaN-on-GaN devices, including very thin GaN-on-GaN HEMTs.

DOI： 10.1002/pssa.202200739

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

The scanning electron microscope (SEM) with photocathode technology was launched by retrofitting the photocathode electron gun to a commercial-based SEM system. In this SEM system, the excitation laser for photoelectron generation from the photocathode is synchronized to the scanning signal. SEM images were obtained by high-speed modulation of the photoelectron beam current using the photocathode SEM, where the location in the field of view and its irradiation current were arbitrarily selected on a pixel-by-pixel basis (Selective e-Beaming technology). As a demonstration experiment contributing to non-contact electrical inspection, low-voltage SEM imaging of MOS-FET structures in 3D-NAND flash memory was performed using this selective e-beam technology. As a result, changes in the voltage contrast of the drain electrode were observed in response to on/off selective electron beam irradiation to the gate electrode in the MOS-FET structure. As an extension of the selective electron beaming technology, a Yield Controlled e-beaming (YCeB) technology was invented to control the secondary electron yield generated in the entire field of view of the SEM image by feedback control of the laser power irradiating the photocathode to the intensity of each pixel in the SEM image. The YCeB image, in which the laser power intensity corresponding to the probe intensity is modulated so that the secondary electron yield generated in the entire field of view of the SEM image is constant, is a clearer image with less noise than the original SEM image.

DOI： 10.1117/12.2657853

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

An InGaN photocathode with a negative electron affinity (NEA) surface is suitable for industrial use because of features such as a long quantum efficiency lifetime, availability with a visible laser as an excitation light source, and the presence of a transmission-type structure. The first objective is the development of an InGaN photocathode electron gun that can be mounted on a scanning electron microscope (SEM) and the evaluation of the electron beam size at the emission point, maximum emission current, and transverse energy of the electron beam, which are important factors for realizing a high probe current in the SEM. The second objective is the evaluation of emission current stability, while the third objective is the generation of a pulsed electron beam and multi-electron beam from the InGaN photocathode. The parameters of the electron beam from the photocathode electron gun were an emission beam radius of 1 µm, transverse energy of 44 meV, and an emission current of up to 110 µA. Using a high beam current with low transverse energy from the photocathode, a 13 nA probe current with 10 nm SEM resolution was observed with 15 µA emission. At 15 µA, the continuous electron beam emission for 1300 h was confirmed; at 30 µA, the cycle time between the NEA surface reactivations was confirmed to be 90 h with 0.043% stability. Moreover, a 4.4 ns pulsed e-beam with a 4.7 mA beam current was generated, and a 5 × 5 multielectron beam with 12% uniformity was then obtained. The advantages of the InGaN photocathode, such as high electron beam current, low transverse energy, long quantum efficiency lifetime, pulsed electron beam, and multi-electron beam, are useful in industries including semiconductor device inspection tools.

DOI： 10.1117/12.2657032

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

Until recently, lack of stable p-type doping source in HVPE hindered its use to the application of III-nitride light emitting devices. Recently, K. Ohnishi discovered the stable MgO source for p-type doping in GaN HVPE. This has enabled the use of HVPE for light emitting devices as well as electron devices such as vertical MOSFET. In this article, we will review the current HVPE technology of p-GaN HVPE, multi-junction AlInGaP/InGaP/GaAs solar cell, InGaN HVPE by tri-chlorides, and discuss the challenge and opportunities of III-nitride HVPE in terms of epitaxial layer design and the remaining issues of the growth of the low temperature buffer, MQWs as well as the source supply design to grow multilayer structures.

DOI： 10.1117/12.2647336

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

To reduce the operating voltage, we analyzed the p-n junction of an aluminum gallium nitride (AlGaN) homojunction tunnel junction (TJ) deep-ultraviolet light-emitting diode using phase-shifting electron holography. We obtained a phase image reflecting the band alignment of the p-n homojunction and derived a depletion layer width of approximately 10 nm. We found the AlGaN homojunction TJ forms a p-n junction. Furthermore, the operating voltage reached 8.8 V at 63 A cm-2 by optimizing the structural characteristics of the AlGaN TJ, such as the thickness and impurity concentration, where the thickness of the TJ was 23 nm. We found that the TJ thickness should be at least the same as the depletion layer width at the AlGaN TJ.

DOI： 10.1117/12.2646757

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Technical Digest - International Electron Devices Meeting, IEDM  

Nearly ideal AlN-based vertical p-n diodes are demonstrated on an AIN substrate utilizing dopant-free distributed-polarization doping (DPD). Capacitance-voltage measurements revealed that the effective doping concentration agreed well with the designed DPD charge concentration. The fabricated devices exhibited a low tum-on voltage of 6.5 V, a low differential specific ON-resistance of 3 mO cm2, and an ideality factor of 2 for a wide range of temperatures (room temperature-573 K). Moreover, the breakdown electric field was 7.3 MV/cm, which was almost twice as high as the reported critical electric field of 4H-SÌC and GaN. These results clearly demonstrate the usefulness of DPD in the fabrication of high-performance AlN-based power devices.

DOI： 10.1109/IEDM45741.2023.10413866

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：AIAA Aviation and Aeronautics Forum and Exposition, AIAA AVIATION Forum 2023  

We demonstrated static characteristics testing and Double-Pulse-Testing (DPT) at 77 K using GaN-Polarization Super Junction (PSJ) transistors, commercialized GaN HEMTs and commercialized SiC-MOSFETs. In the results of SiC-MOSFETs, total switching losses increased at 77 K due to the increase in on-resistance (Ron). On the other hand, in the results of GaN-PSJ transistors, total switching losses decreased at 77 K due to the increase in channel mobilities. In the case of GaN-PSJ transistors, energy losses which are induced self-charging and discharging (Eqoss) in the upper side DUT increased at 77 K. From the measurement of Vds dependence of Cds, Cds increased at 77 K compared with room temperature conditions. However, total switching losses decreased at low temperatures because Eqoss accounts for about 10% of the switching losses.

DOI： 10.2514/6.2023-4538

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Scientific Reports  

Lanthanoid-doped Gallium Nitride (GaN) integrated into nanophotonic technologies is a promising candidate for room-temperature quantum photon sources for quantum technology applications. We manufactured praseodymium (Pr)-doped GaN nanopillars of varying size, and showed significantly enhanced room-temperature photon extraction efficiency compared to unstructured Pr-doped GaN. Implanted Pr ions in GaN show two main emission peaks at 650.3 nm and 651.8 nm which are attributed to 3P0-3F2 transition in the 4f-shell. The maximum observed enhancement ratio was 23.5 for 200 nm diameter circular pillars, which can be divided into the emitted photon extraction enhancement by a factor of 4.5 and the photon collection enhancement by a factor of 5.2. The enhancement mechanism is explained by the eigenmode resonance inside the nanopillar. Our study provides a pathway for Lanthanoid-doped GaN nano/micro-scale photon emitters and quantum technology applications.

DOI： 10.1038/s41598-022-25522-6

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PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Environment International  

A general-purpose virus inactivation unit that can inactivate viruses was developed using deep ultraviolet (DUV) LEDs that emit DUV rays with a wavelength of 280 nm. The inside of the virus inactivation unit is a rectangular conduit with a sharp turn of 180° (sharp-turned rectangular conduit). Virus inactivation is attempted by directly irradiating the air passing through the conduit with DUV rays. The flow characteristics of air and virus particles inside the virus inactivation unit were investigated using numerical simulations. The air was locally accelerated at the sharp turn parts and flowed along the partition plate in the sharp-turned rectangular conduit. The aerosol particles moving in the sharp-turned rectangular conduit were greatly bent in orbit at the sharp turn parts, and then rapidly approached the partition plate at the lower part of the conduit. Consequently, many particles collided with the partition plates behind the sharp-turn parts. SARS-CoV-2 virus was nebulized in the virus inactivation unit, and the RNA concentration and virus inactivation rate with and without the emission of DUV-LEDs were measured in the experiment. The concentration of SARS-CoV-2 RNA was reduced to 60% through DUV-LED irradiation. In addition, SARS-CoV-2 passing through the virus inactivation unit was inactivated below the detection limit by the emission of DUV-LEDs. The virus inactivation rate and the value of the detection limit corresponded to 99.38% and 35.36 TCID50/mL, respectively.

DOI： 10.1016/j.envint.2022.107580

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PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Vacuum Science and Technology B  

Pulsed electron beams from a photocathode using an InGaN semiconductor have brought selectively scanning technology to scanning electron microscopes, where the electron beam irradiation intensity and area can be arbitrarily selected within the field of view in SEM images. The p-type InGaN semiconductor crystals grown in the metalorganic chemical vapor deposition equipment were used as the photocathode material for the electron beam source after the surface was activated to a negative electron affinity state in the electron gun under ultrahigh vacuum. The InGaN semiconductor photocathode produced a pulsed electron beam with a rise and fall time of 3 ns, consistent with the time structure of the irradiated pulsed laser used for the optical excitation of electrons. The InGaN photocathode-based electron gun achieved a total beam operation time of 1300 h at 15 μA beam current with a downtime rate of 4% and a current stability of 0.033% after 23 cycles of surface activation and continuous beam operation. The InGaN photocathode-based electron gun has been installed in the conventional scanning electron microscope by replacing the original field emission gun. SEM imaging was performed by selective electron beaming, in which the scanning signal of the SEM system was synchronized with the laser for photocathode excitation to irradiate arbitrary regions in the SEM image at arbitrary intensity. The accuracy of the selection of regions in the SEM image by the selective electron beam was pixel by pixel at the TV scan speed (80 ns/pix, 25 frame/s) of the SEM.

DOI： 10.1116/6.0002111

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Communications Engineering  

Optical fiber curvature sensors have been considered as a promising option for human motion detection due to its good toughness, bending flexibility and anti-electromagnetic interference. However, for wearable devices, the miniature configuration is preferred, and a high integration of the light emitter, receiver and guided fiber is essential to configure the miniaturized sensing system. Here, we present a miniaturized curvature sensing system by integrating a GaN-based optoelectronic chip with the plastical optical fiber (POF). The light emitter and detector are fabricated on a GaN-on-sapphire wafer to form a tiny chip sized at 2.5 × 1.5 mm2. The on-chip photodetector (PD) effectively senses the reflected light intensity, extracting information on the fiber bending deformation. A compact curvature sensing system is demonstrated for finger motion detection with movement angles of 30–90° and frequencies of 0.4, 1, and 1.6 Hz. The results show that the monolithically integrated LED and PD chip can be combined with the POF with reliable operation. The demonstration of the monolithically integrated optoelectronic device suggests a promising potential technology for future wearable fiber optical sensor system.

DOI： 10.1038/s44172-022-00049-w

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

Although the pulsed operation of AlGaN-based laser diodes at UV-C wavelengths has been confirmed in the previous studies, continuous oscillation without cooling is difficult because of the high operating voltage. In this study, the temperature dependence of key parameters was investigated and their impact on achieving continuous-wave lasing was discussed. A reduction in the threshold voltage was achieved by tapering the sides of the laser diode mesa and reducing the lateral distance between the n- and p-electrodes. As a result, continuous-wave lasing at room temperature was demonstrated at a threshold current density of 4.2 kA / cm 2 and a threshold voltage of 8.7 V.

DOI： 10.1063/5.0124480

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

Previously reported UV-C laser diode (LD) structures have been subject to design constraints owing to dark line defects at the edge of the mesa stripe after device fabrication. To address this issue, a detailed analysis revealed that the dark line defects were dislocations generated by local residual shear stresses associated with mesa formation on highly strained epitaxial layers. A technique for controlling the local concentration of shear stress using a sloped mesa geometry was proposed based on insight gained by modeling the stress distribution at the edge of the mesa stripe. Experimental results showed that this technique succeeded in completely suppressing the emergence of dark-line defects. This technique will be useful in improving the performance of pseudomorphic AlGaN/AlN-based optoelectronic devices, including UV-C LDs.

DOI： 10.1063/5.0124512

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：ECS Journal of Solid State Science and Technology  

We report the fabrication of high-barrier-height and thermally reliable Schottky contacts to n-Al0.6Ga0.4N by using an Ag-Pd-Cu (APC) alloy. The Schottky barrier heights (SBHs) and ideality factors computed using the current-voltage (I-V) model ranged from 0.82 to 0.97 eV and from 3.15 to 3.44, respectively. The barrier inhomogeneity model and capacitance-voltage (C-V) method yielded higher SBHs (1.62-2.19 eV) than those obtained using the I-V model. The 300 °C-annealed APC sample exhibited more uniform electrical characteristics than the 500 °C-annealed Ni/Au Schottky samples (each with the best Schottky behavior). Furthermore, the scanning electron microscopy (SEM) and scanning transmission electron microscopy (STEM) results indicated that the APC Schottky contacts were more thermally stable than the Ni/Au contacts. On the basis of the X-ray photoemission spectroscopy (XPS) results, the improved Schottky characteristics of the APC alloy contacts are described and discussed.

DOI： 10.1149/2162-8777/aca1df

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

We evaluated Mg-diffusion into GaN from GaN/Mg mixture. The diffusion depth of Mg increased with diffusion temperature from 1100 °C to 1300 °C, whereas the Mg concentration remained constant at 2-3 × 1018 cm−3 independent of temperature. The estimated activation energy for Mg diffusion was 2.8 eV, from which the substitutional diffusion mechanism was predicted. Mg-diffused GaN samples showed p-type conductivity with a maximum hole mobility of 27.7 cm2 V−1 s−1, suggesting that substitutional diffusion contributes to Mg activation. This diffusion technique can be used to easily form p-type GaN and has potential as a p-type selective doping technique.

DOI： 10.35848/1882-0786/ac9c83

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

Photocathodes with negative electron affinity (NEA) characteristics have various advantages, such as small energy spread, high spin polarization, and ultrashort pulsing. Nitride semiconductors, such as GaN and InGaN, are promising materials for NEA photocathodes because their lifetimes are longer than those of other materials. In order to further prolong the lifetime, it is important to better understand the deterioration of NEA characteristics. The adsorption of residual gases and back-bombardment by ionized residual gases shorten the lifetime. Among the adsorbed residual gases, H2O has a significant influence. However, the adsorption structures produced by the reaction with H2O are not comprehensively studied so far. In this study, we investigated adsorption structures that deteriorated the NEA characteristics by exposing InGaN and GaAs to an H2O environment and discussed the differences in their lifetimes. By comparing the temperature-programmed desorption curves with and without H2O exposure, the generation of CsOH was confirmed. The desorption of CsOH demonstrated different photoemission behaviors between InGaN and GaAs results. InGaN recovered its NEA characteristics, whereas GaAs did not. Considering the Cs desorption spectra, it is difficult for an NEA surface on InGaN to change chemically, whereas that for GaAs changes easily. The chemical reactivity of the NEA surface is different for InGaN and GaAs, which contributes to the duration of photoemission. We have attempted to prolong the lifetime of InGaN by recovering its NEA characteristics. We found that InGaN with NEA characteristics can be reused easily without thermal treatment at high temperatures.

DOI： 10.1063/5.0125344

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

GaN-based devices have grown rapidly in recent decades, due to their important research value and application prospects. There is a desire to monolithically integrate different GaN devices into a single chip for the development of future optoelectronic systems with low power consumption. In addition to improved multifunctional performance, a miniature integrated system can result in a significant reduction in material costs, processing costs, and packaging costs. In view of such prospects, we propose monolithic, top-down approaches to build III-nitride transmitter, modulator, waveguide, beam splitter, receiver, and monitor as a single unit onto a conventional GaN-on-silicon wafer without involving regrowth or postgrowth doping. Data communication among these components is realized through light propagation, opening up horizons for GaN optoelectronic systems on a chip.

DOI： 10.1063/5.0125324

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Surface Science  

A high quantum efficiency (QE) can be obtained on negative electron affinity (NEA) surfaces. It is well-known that NEA surfaces can be formed on semiconductor materials such as GaAs by the alternating supply of cesium (Cs) and oxygen (O2), which is called the yo-yo method. While GaN and related compounds such as InGaN are expected to realize an NEA photocathode with a long lifetime, the surface reactions between GaAs and nitride semiconductors are completely different with respect to the increasing rate of QE induced by the supply of O2. In addition, the surface processes of photoemission from NEA nitride semiconductors have not yet been elucidated. In the present study, a higher QE was achieved in InGaN by simultaneously supplying Cs and O2 instead of using the conventional yo-yo method. The possible Cs adsorption states in relation to the photoemission are also discussed based on the QE tendencies and the temperature programmed desorption (TPD) spectra of the NEA surfaces formed under elevated temperature conditions. This study suggests that the Cs oxide species, which is one of the key compounds for imparting the NEA nature, decomposes at approximately 350 °C and that the InGaN-Cs2O2 structure is a possible candidate for NEA photocathodes.

DOI： 10.1016/j.apsusc.2022.153882

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Materials  

For the fundamental understanding and the technological development of the ammonothermal method for the synthesis and crystal growth of nitrides, an in situ monitoring technique for tracking mass transport of the nitride throughout the entire autoclave volume is desirable. The feasibility of using high-energy computed tomography for this purpose was therefore evaluated using ex situ measurements. Acceleration voltages of 600 kV were estimated to yield suitable transparency in a lab-scale ammonothermal setup for GaN crystal growth designed for up to 300 MPa operating pressure. The total scan duration was estimated to be in the order of 20 to 40 min, which was sufficient given the comparatively slow crystal growth speed in ammonothermal growth. Even shorter scan durations or, alternatively, lower acceleration voltages for improved contrast or reduced X-ray shielding requirements, were estimated to be feasible in the case of ammonoacidic growth, as the lower pressure requirements for this process variant allow for thinned autoclave walls in an adapted setup designed for improved X-ray transparency. Promising nickel-base and cobalt-base alloys for applications in ammonothermal reactors with reduced X-ray absorption in relation to the maximum operating pressure were identified. The applicability for the validation of numerical simulations of the growth process of GaN, in addition to the applicability of the technique to further nitride materials, as well as larger reactors and bulk crystals, were evaluated.

DOI： 10.3390/ma15176165

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PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We studied indium incorporation into InGaN/GaN quantum wells grown by metal-organic vapor phase epitaxy by systematically varying of gallium and indium precursor flows on (0001), (10 1 ¯3), (11 2 ¯2), and (10 1 ¯0) orientations. The layer thickness and indium composition obtained from x-ray diffraction analysis were correlated with a model based on indium and gallium incorporation efficiencies. In the model, the indium incorporation efficiency is reproduced by the Langmuir surface coverage of gallium, indicating that indium atoms close to gallium atoms can be incorporated preferably.

DOI： 10.1063/5.0088908

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Crystal Growth  

The effects of halide vapor phase epitaxial (HVPE) growth conditions such as input V/III ratio and substrate off-cut angle on the surface morphology of n-type GaN layers grown on GaN (0001) freestanding substrates were investigated to develop a model for growing smooth surfaces. The spiral hillock density increased with increasing input V/III ratio and/or decreasing off-cut angle. The critical off-cut angle between the spiral growth and the step-flow growth depended on the vapor supersaturation calculated by thermodynamic analysis. To understand the transition of the growth mode, we proposed a Burton–Cabrera–Frank-theory-based model considering the effect of spiral growth, which was utilized to explain the obtained experimental results. The developed growth model can be effective for predicting the HVPE growth mode between the spiral growth and the step-flow growth.

DOI： 10.1016/j.jcrysgro.2022.126749

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Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Journal of Alloys and Compounds  

In this study, chlorine (Cl) treatment was carried out on p-AlGaN to enhance the performance of ultraviolet-C light emitting diodes (UVC LEDs) by modifying ITO work function and hence reducing the contact resistance of ITO/Al reflector. The Cl-treated UVC LEDs exhibit the forward voltage of 6.88 V at 20 mA, whereas the reference samples show 7.50 V. The light output power and relative wall plug efficiency (WPE) of the Cl-treated UVC LEDs are enhanced by 17.1% at 500 mW and 19.5% at 100 mA, respectively, as compared to the reference. Additionally, the Cl-treated LEDs also display reduction in both the leakage current and ideality factor. Further, the photoluminescence (PL) intensity of AlGaN micro-disks is also enhanced by the Cl-treatment. X-ray photoemission spectroscopy (XPS) results indicate the formation of Cl-ITO at the ITO/p-AlGaN interface and the passivation of the surface states of AlGaN by Cl radicals. Based on the XPS results, a possible mechanism for the improved performance of Cl-treated UVC AlGaN-based LEDs is described and discussed.

DOI： 10.1016/j.jallcom.2022.164895

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

Energy-dispersive X-ray signals calibrated by Rutherford backscattering indicated the generation of Al13/24Ga11/24N in Ga-rich stripes in a nonflat Al0.58Ga0.42N layer. Also, the CL peak wavelengths of ∼259 and 272 nm also showed the generation of Al15/24Ga9/24N and Al13/24Ga11/24N in Al-rich zones and Ga-rich stripes, respectively. The wavelength of a strong CL peak at ∼246 nm, which was observed from the Al0.7Ga0.3N layer in our previous study, is also considered to correspond to the near-band-emission wavelengths of Al17/24Ga7/24N. In particular, the stronger reproducibility of metastable Al15/24Ga9/24N generation was confirmed, in agreement with the computed predictions by other research groups.

DOI： 10.35848/1882-0786/ac79a1

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Physica Status Solidi - Rapid Research Letters  

Herein, the operation of dopant-free GaN-based p-n junctions formed by distributed polarization doping (DPD) is experimentally demonstrated and their space charge profiles and carrier transport properties are investigated. The device exhibits ideal space charge profiles explained by polarization effects and demonstrates the excellent controllability of DPD. In addition, it shows rectification and electroluminescence under forward-biased conditions. The carrier transport properties could be explained by the conventional recombination/diffusion model used for impurity-doped p-n junctions. Repeatable breakdowns are also observed in all devices and the temperature-dependent breakdown voltages reveal that the breakdowns are caused by avalanche multiplication, which is also the same as those reported in impurity-doped GaN p-n diodes. These results indicate that DPD is a promising doping technology for GaN-based power devices overcoming any issues associated with conventional impurity doping.

DOI： 10.1002/pssr.202200127

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Physics D: Applied Physics  

The metastability of Al n/12Ga1-n/12N (n = 2, 3, and 4) was investigated by the statistical analysis of electroluminescence (EL) spectra having dual peaks with a peak-to-peak distance (pp) of >10 nm generated from nonflat Al x Ga1-x N (x ∼0.2) quantum wells (QWs) fabricated on c(0001) sapphire substrates with a miscut of 1.0° towards the m[1 1ˉ 00] axis. To explain the origins of the dual-peak EL (DPEL) spectra, which are often observed for AlGaN-QWs with Ga content of greater than 0.7, a nonflat QW model incorporating two metastable compositions, Al(n-1)/12Ga1-(n-1)/12N and Al n/12Ga1-n/12N (n: integer), is proposed. By the statistical analysis of peak wavelengths in DPEL spectra and the verification of EL spectral shapes, two series of featured EL peak wavelengths with intervals of 2-3 nm were obtained from five out of six LED wafers. The two series of featured EL peak wavelengths were assigned by comparison with the calculated EL wavelengths. Then, Al2/12Ga10/12N and Al3/12Ga9/12N were determined to be the origins of peaks with the longer and shorter wavelengths in the DPEL, respectively, in addition to the metastable Al n/12Ga1-n/12N (n= 4-9) compositions observed in our previous studies. When DPEL (pp> 10 nm) appeared, the difference in QW thickness between Al2/12Ga10/12N and Al3/12Ga9/12N tended to be larger than one monolayer (ML), indicating a significant amount of Ga or GaN mass transport. Furthermore, the Al2/12Ga10/12N and Al3/12Ga9/12N QWs are considered to have thicknesses of m ML (m: consecutive integers), suggesting the 1 ML configuration of Al and Ga atoms on the c(0001) plane. In addition, the DPEL obtained from nonflat Al x Ga1-x N (x ∼0.25) QWs by another research group was shown to be related to two metastable Al n/12Ga1-n/12N (n = 3, 4), similarly to our one exceptional LED wafer, which also agreed with the model proposed in this work.

DOI： 10.1088/1361-6463/ac5d03

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1038/s41598-022-12628-0

PubMed

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Optics Letters  

This Letter describes the impact of shape on micro light-emitting diodes (µLEDs), analyzing 400 µm2 area µLEDs with various mesa shapes (circular, square, and stripes). Appropriate external quantum efficiency (EQE) can yield internal quantum efficiency (IQE) which decreases with increasing peripheral length of the mesas. However, light extraction efficiency (ηe) increased with increasing mesa periphery. We introduce analysis of Jpeak (the current at peak EQE) since it is proportional to the non-radiative recombination. Etching the sidewalls using tetramethylammonium hydroxide (TMAH) increased the peak EQE and decreased the sidewall dependency of Jpeak. Quantitatively, the TMAH etching reduced non-radiative surface recombination by a factor of four. Hence, shrinking µLEDs needs an understanding of the relationship between non-radiative recombination and ηe, where analyzing Jpeak can offer new insights.

DOI： 10.1364/OL.456993

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PubMed

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Journal of Applied Physics  

As the size of micro light-emitting diodes (μLEDs) decreases, μLEDs encounter etching damage especially at the sidewalls that critically affects their properties. In this study, we investigated the influence of etching bias power (Pbias) on the performance of μLEDs and found that the current-voltage and light output-current characteristics of μLEDs were enhanced when Pbias was reduced. It was shown that at low Pbias, the chemical reaction between etching gas and gallium nitride, rather than ion sputtering, dominated the etching process, leading to low plasma damage and rough surface morphology. Additionally, to understand the etching-induced surface roughening behaviors, various substrates with different threading dislocation densities were treated at low Pbias. It was found that for the sample (with p-contact size of 10 × 10 μm2), the efficiency droop was approximately 20%, although the current reached 10 mA due most probably to the suppressed polarization effect in the quantum well. It was further observed that the external quantum efficiency (EQE) was dependent on Pbias, where the lowest Pbias yielded the highest maximum EQE, indicating that the plasma damage was mitigated by reducing Pbias. Optimization of dry etching and polarization-suppression conditions could pave the way for realizing high-performance and brightness μLEDs for next-generation displays.

DOI： 10.1063/5.0085384

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

An AlGaN/GaN heterojunction bipolar transistor (HBT) with N-p-n configuration was fabricated by the "regrowth-free"method, resulting in a contamination-free emitter-base AlGaN/GaN heterojunction. The low-bias-power-based low-damage inductively coupled plasma-reactive ion etching was employed in this study for emitter mesa definition instead of the conventional selective-area-regrowth technique. The method successfully minimized the etching-induced damage in the p-GaN base layer and the contamination at the emitter-base AlGaN/GaN heterojunction. Consequently, the fabricated device exhibited a high current gain of 25, the highest current density of 15.0 kA cm-2, and the lowest on-state voltage offset of 0.75 V ever reported for AlGaN/GaN HBTs.

DOI： 10.35848/1882-0786/ac6197

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

The working mechanism of the anti-parasitic-reaction (APR) catalyst of tungsten carbide (WC) coating on graphite in hydride vapor phase epitaxy GaN growth were examined. During NH3 annealing, the surface of WC is reduced as well as nitrided. The W2N topmost layer was found to work as an APR-active catalyst to suppress the formation of GaN polycrystals during high-rate HVPE-GaN growth, while the regions covered with thick pyrolytic graphite residues were catalytically inert. The formation of an additional W2C top layer on the WC underlayer was demonstrated to exhibit superior APR activity, i.e. complete suppression of GaN polycrystal formation.

DOI： 10.35848/1882-0786/ac5ba4

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

In this study, we enhanced the emission power of AlGaN-based tunnel junction deep-ultraviolet LEDs (TJ LEDs) by using a MgZnO and aluminum stacked structure as UV reflective electrodes on the anode side. The emission wavelength of the fabricated TJ LED was 284 nm, and the emission power was 57.3 mW at 63 A cm-2. The polycrystalline MgZnO enabled both conductivity and UV transmittance to be achieved, approximately doubling with a reflectance of the fabricated TJ LED at 284 nm compared to conventional TJ LED with Ti/Al. These factors contributed to the increased emission power of TJ LEDs.

DOI： 10.35848/1882-0786/ac5acf

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Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

We demonstrated the structural optimization of AlGaN tunnel junction (TJ) deep-ultraviolet light-emitting diodes by changing the thickness and impurity concentrations of p+-type and n+-type AlGaN constituting the TJ. By decreasing the total thickness of the TJ to 23 nm, the operating voltage reached a minimum of 8.8 V at 63 A cm-2. Further decrease in TJ thickness markedly increases the operating voltage. This finding implies that the depletion layer width becomes greater than the TJ thickness if it is smaller than 12 nm. Therefore, we conclude that the TJ thickness must be greater than the depletion layer width.

DOI： 10.35848/1882-0786/ac60c7

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Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

In this work, a deliberate etching-based top-down approach is proposed to fabricate the GaN nanorod (NR) Schottky barrier diode (SBD). As a key step during the fabrication, the impact of the wet-etching process on device performance is systematically studied. By virtue of the reduced surface states at the sidewall, the performance of NR SBD with the wet-etching process is substantially improved, delivering a forward turn-on voltage of 0.65 V, a current density of ∼10 kA/cm2 at 3 V, an ideality factor of 1.03, an ON/OFF current ratio of ∼1010, and no severe current collapse, along with a reverse breakdown voltage of 772 V.

DOI： 10.1063/5.0083194

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：ECS Journal of Solid State Science and Technology  

For micro-light-emitting diode (LED)-based display applications, such as virtual reality and augmented reality, high-performance Ohmic contacts (namely, the improvement of current injection efficiency) is vital to the realization of high-efficiency micro-LEDs. The surface Fermi level pinning characteristics could be comprehended in terms of the relation between work function of metals (M) and Schottky barrier height (SBH, B). In this study, we have investigated the surface Fermi level pinning characteristics of (001) n-AlInP surfaces by employing Schottky diodes with different metals. With an increase in the temperature, B increases linearly and ideality factors (n) decreases. This behavior is related to the barrier height inhomogeneity. Inhomogeneity-modelbased B is evaluated to be in the range of 0.86 1.30 eV, which is dependent on the metal work functions and are similar to those measured from capacitance-voltage relation. Further, The S-parameter, the relation between B and M (d B/d M), is 0.36. This is indicative of the partial pinning of the surface Fermi level at the surface states placed at 0.95 eV below the conduction band. Furthermore, it is also shown that (NH4)2S-passivation results in an increases the mean SBH and the S-parameter (e.g., 0.52).

DOI： 10.1149/2162-8777/ac5d66

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

We analyzed the p-n junction of an aluminum gallium nitride (AlGaN) homojunction tunnel junction (TJ) deep-ultraviolet light-emitting diode by phase-shifting electron holography. We clearly obtained a phase image reflecting the band alinement of the p-n homojunction and derived a depletion layer width of approximately 10 nm. In addition, the observed depletion layer width for the AlGaN TJ was in good agreement with the simulated one reflecting the diffusion profile of Mg and Si, thus enabling a discussion on the electrical conduction mechanism for an AlGaN p-n junction.

DOI： 10.35848/1882-0786/ac53e2

Web of Science

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japan Society of Applied Physics  

DOI： 10.11470/jsapmeeting.2022.1.0_1343

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

We evaluated the beam current dependence of defect formation during Mg ion implantation into GaN at a high temperature of 1100 °C with two beam currents. Photoluminescence spectra suggest that low-beam-current implantation reduced the vacancy concentration and activated Mg to a greater extent. Moreover, scanning transmission electron microscopy analysis showed that low-beam-current implantation reduced the density of Mg segregation defects with inactive Mg and increased the density of intrinsic dislocation loops, suggesting decreases in the densities of Ga and N vacancies. The formation of these defects depended on beam current, which is an important parameter for defect suppression.

DOI： 10.35848/1882-0786/ac481b

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Journal of Applied Physics  

Advances in obtaining untwinned (10 1 ¯3)-oriented semi-polar GaN enable a new crystal orientation for the growth of green and red LED structures. We present a scanning electron microscopy study that combines the structural characterization of electron channeling contrast imaging with the optical characterization of cathodoluminescence hyperspectral imaging on a (10 1 ¯ 3) GaN layer. An extensive defect analysis revealed that the dominant defects consist of basal plane stacking faults (BSFs), prismatic stacking faults, partial dislocations, and threading dislocations. With a defect density of about an order of magnitude lower than in comparable. The optical properties of the defects have been characterized from 10 to 320 K, showing BSF luminescence at room temperature indicating a reduced density of non-radiative recombination centers in the as-grown samples compared to established semi- and non-polar orientations. Our findings suggest that growth along (10 1 ¯3) has the potential for higher radiative efficiency than established semi-polar orientations.

DOI： 10.1063/5.0077084

Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

Heterogeneous integration is important to create multi-functionality in future electronic devices. However, few thermal studies of the interfaces formed in these integrated devices have been reported before. Recently, integrated interfaces by surface-Activated bonding were found to have high thermal boundary conductance, which provides a solution for heat dissipation of GaN and β-Ga2O3-based power electronics. Here, we review the recent progress on the interfacial thermal transport across heterogeneously integrated interfaces, including transferred van der Waals force bonded interfaces, surface-Activated bonded interfaces, plasma bonded interfaces, and hydrophilic bonded interfaces. This Perspective specifically focuses on applications of thermal management strategies of electronics, especially power electronics. Finally, the challenges, such as high-Throughput thermal measurements of buried interfaces, thermal property-structure relations of interfaces bonded under different conditions, theoretical understanding of interfacial thermal transport, and device demonstrations, are pointed out.

DOI： 10.1063/5.0077039

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Japanese Journal of Applied Physics  

The presence of hexagonal-pyramid-shaped hillocks (HPHs) in AlGaN epitaxial films affects device characteristics; this effect is significant in DUV laser diodes (LDs) on AlN substrates, where the presence of HPHs under the p-electrode increases the threshold current density and inhibits the lasing. In this study, we investigated the difference between the lasing characteristics of LDs with and without HPHs. It was found that in the presence of HPHs, the threshold excitation power density increased and the slope efficiency decreased by optical excitation. To investigate the cause of these phenomena, we performed structural, optical, and electrical analyses of the HPHs. Various imaging techniques were used to directly capture the characteristics of the HPHs. As a result, we concluded that HPHs cause the degradation of LD characteristics due to a combination of structural, optical, and electrical factors.

DOI： 10.35848/1347-4065/ac3a1d

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：IEEE Electron Device Letters  

We demonstrated the formation of excellent Ohmic contact to p-type GaN (including the plasma etching-damaged p-type GaN which otherwise exhibited undetectable current within ±5 V) by the post-growth diffusion of magnesium. The specific contact resistivity on the order of 10-4Omega cm2 (extracted at V=0 V) was achieved on the plasma-damaged p-GaN with linear current-voltage characteristics by the transfer length method (TLM) measurement. The improvement in current by a factor of over 109 was also obtained on the plasma-damaged p-n junction diode after the same Mg-treatment. These experimental results indicate a great potential of post-growth diffusion of Mg to overcome the bottleneck of forming a good Ohmic contact to p-GaN.

DOI： 10.1109/LED.2021.3131057

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

ISAMU AKASAKI, crystal grower, a pioneer of GaN-based blue light-emitting diodes (LEDs), and a Nobel Laureate in Physics, passed away because of pneumonia on April 1, 2021 at the age of 92. According to the Nobel Foundation, the LED lamp holds considerable promise for improving the quality of life of over 1.5 billion people worldwide who lack access to electricity grids. Owing to its low power requirements, it can be powered by cheap local solar energy. In this article, his pursuit of blue LEDs for 20 years is described.

DOI： 10.1117/12.2619005

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：IEEE Journal of the Electron Devices Society  

In this paper, a technique to develop small signal circuit (SSC) models of AlGaN/GaN high electron mobility transistors (HEMTs) using dependent current sources is presented. In this technique, experimentally measured broadband Y-parameters of AlGaN/GaN HEMTs are mathematically modeled as a sum of pole-residue terms. By representing each pole-residue term as a dependent current source, it is possible to develop an accurate SSC models for HEMTs which otherwise may not be possible using passive resistive-inductive-capacitive elements. The accuracy of the proposed SSC model is validated against the conventional SSC model using a 2nd, 3rd and 4th order rational function representation of the admittance branches of AlGaN/GaN HEMTs. Therefore, the proposed SSC model turns out to be highly robust in nature and can take care of any form of the transfer functions of the admittance branches between the gate, drain, and source terminal of an AlGaN/GaN HEMT.

DOI： 10.1109/JEDS.2022.3208028

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：2022 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2022  

Exciting high performance power electronic devices have been widely demonstrated and manufactured using GaN epitaxial layers, but the majority of these devices have been fabricated on lattice mismatched substrates, including SiC, Si, or sapphire. Unfortunately, using lattice mismatched substrates inevitably introduces high concentrations of point defects and dislocations into the GaN epilayers, and these defects degrade the electrical performance of the fabricated GaN devices. Also, the mismatch of lattice constant and coefficient of thermal expansion cause strain and wafer bowing in the GaN epi, which further degrade the quality material for device fabrication. Using lattice matched GaN substrates provides solutions to these problems. In 2014, the Ministry of the Environment launched a national project to develop the required technology and to prove the superiority of GaN on GaN devices in real systems, with more than 10 partnerships from academia and industry. The project included work in several areas, including GaN substrate growth, GaN epitaxy, material characterization, and fabrication of devices and ICs for application in various systems. Large area GaN substrates have been grown with low defect densities, which has enabled fabrication of new types of vertical and horizontal GaN devices. The GaN devices have been used in servers, solar cell power conditioners, microwave ICs, distribution transformers, electric vehicle power converters. The performance improvements were compared with conventional approaches in each case. An “ALL GaN vehicle” has also been demonstrated, in which GaN devices are used in all power components. In this talk, we will present these results which show the great potential of GaN on GaN devices in the industry.

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japan Society of Mechanical Engineers  

<p>A desktop-type air curtain device capable of being installed on a desk to protect healthcare workers from infectious diseases was developed. Pseudo-exhaled air containing aerosol particles emitted from a mannequin was blown toward the air curtain generated by the air curtain device. The aerosol blocking effect of the air curtain device was investigated using particle image velocimetry measurements. Air curtain flow was maintained inside the gate of the air curtain device. The aerosol particles approaching the air curtain device were observed to abruptly bend towards the suction port without passing through the gate, signifying that the aerosol particles were blocked by the air curtain flow.</p>

DOI： 10.1299/jsmemecj.2022.s055-10

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japan Society of Mechanical Engineers  

<p>A virus inactivation unit that can inactivate viruses was developed using deep ultraviolet (DUV) LEDs that emit DUV rays with a wavelength of 280 nm. The flow characteristics of virus particles inside the virus inactivation unit were investigated using numerical simulations. The percentage of particles colliding on the inner wall of the virus inactivation unit is 56 %. Especially, many particles collide with the partition plates behind the sharp-turn parts.</p>

DOI： 10.1299/jsmemecj.2022.s055-11

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japan Society of Mechanical Engineers  

DOI： 10.1299/jsmefed.2022.os03-22

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Advanced Engineering Materials  

The integration of III-nitride electronics and photonics is of great interest toward future computing systems with low power consumption. Multifunctioning multiple quantum well (MQW) diodes can address the challenging issue for on-chip integration of a light source, which is a key component to drive the photonic circuits. Herein, a transmitter, waveguide, modulator, and receiver are monolithically integrated on a III-nitride-on-silicon platform to perform light emission, transmission, modulation, and detection simultaneously. Both the receiver and modulator exhibit sufficient sensitivity to optical signals from the transmitter, which has an identical InGaN/AlGaN multiple quantum well (MQW) structure because the III-nitride diode provides spectral overlap between the emission and absorption spectra. On-chip data communication among these optical components is achieved using light, and the effective wavelength range is from 365 to 385 nm, in which multifunctional devices can be operated.

DOI： 10.1002/adem.202100582

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Journal of Physics D: Applied Physics  

When nonflat Al x Ga1-x N quantum wells (QWs) for producing 285 nm light emitting diodes (LEDs) were fabricated on n-AlGaN on AlN templates with dense macrosteps on c(0001) sapphire substrates with a 1.0 miscut relative to the m[1-100] axis, composite electroluminescence (EL) spectra from both inclined and terrace zones in Al x Ga1-x N QWs (x∼ 1/3) were generated owing to compositional and thickness modulations. The shoulder or main peaks in composite EL spectra tended to locate at fixed discrete wavelengths of ∼287, ∼292, and ∼296 nm from 12 nonuniform 285 nm LED wafers that were involved in nonnegligible run-to-run drift, even though these wafers were fabricated using the same source gas flow parameters for metal-organic vapor phase epitaxy. The discrete wavelengths of ∼287, ∼292, and ∼296 nm were attributed to EL from Al1/3Ga2/3N QWs with thicknesses of 8, 9, and 10 monolayers (ML), respectively, by referring to the results of cathodoluminescence (CL) analysis. Also, when nonflat Al x Ga1-x N QWs (x∼ 1/2) for 265 nm LEDs were grown, single-peak-like EL spectra were mainly generated from the inclined zones in nonflat QWs. The EL spectra taken from four nonuniform 265 nm LED wafers tended to show weak structures or main peaks at ∼257, ∼261, ∼266, and ∼271 nm, which were also attributed to emissions from Al1/2Ga1/2N QWs with thicknesses of 5, 6, 7, and 8 ML, respectively, by referring to CL analysis results. The creation of Al1/3Ga2/3N and Al1/2Ga1/2N in nonflat QWs in this work was in agreement with the results of our previous studies that indicated the creation of metastable Al n/12Ga1-n/12N (n: consecutive natural numbers). Furthermore, QW thicknesses of consecutive n ML may imply that Al1/3Ga2/3N and Al1/2Ga1/2N have 1 ML configurations of Al and Ga atoms on a c(0001) plane.

DOI： 10.1088/1361-6463/ac2065

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics  

In this study, we generated 25 multielectron beam (MEB) using an InGaN photocathode with a negative electron affinity state irradiating with 25 multilaser beam. The uniformity of the MEB and the total electron beam current were evaluated. A laser beam was split into 25 laser beams using a spatial light modulator. The coefficient of variation (CV) of laser power was 20%. The CV of quantum efficiency was 1.1%. The CV of electron beam current was 12%, and the total current was about 1.2 μA. These results will enhance the development of the MEB-defect inspection using the InGaN photocathode.

DOI： 10.1116/6.0001272

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：IEEE Transactions on Electron Devices  

Conventional lumped small signal circuit (SSC) models of AlGaN/GaN metal oxide semiconductor high electron mobility transistors (MOS-HEMTs) are derived from the low frequency portion of the experimentally measured ${Y}$ -parameters. Consequently, these models cannot faithfully capture the high frequency behavior of the device. In this work, modified SSC models of AlGaN/GaN MOS-HEMTs are developed by fitting the entire broadband measured ${Y}$ -parameters of the device with rational functions. These rational functions are then physically realized using additional passive circuit elements added to the conventional SSC model. The accuracy of the proposed SSC models can be improved by increasing the order of the rational functions. The proposed models are demonstrably more accurate than the conventional SSC models in estimating the higher order poles and zeroes present in the experimentally measured ${Y}$ -parameters of AlGaN/GaN MOS-HEMTs.

DOI： 10.1109/TED.2021.3119528

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

After the paper was published,1we found errors in the manuscript shown in page 152102-2. In the original published article, the SIMS detec-tion limits of [O] and [H] were written as 7 × 1015and 3 × 1015cm-3, respectively. The corrected detection limits of [O] and [H] are 6 × 1015and 3 × 1016cm-3, respectively. The SIMS depth profiles shown in Fig. 2(b) and the conclusions of the paper are not affected by this erratum.

DOI： 10.1063/5.0077364

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Authorship：Lead author   Language：English   Publishing type：Research paper (scientific journal)  

Web of Science

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

A vertical GaN p+-n junction diode with an ideal breakdown voltage was grown by halide vapor phase epitaxy (HVPE). A steep p+-n interface was observed even with the use of the HVPE method. No Si-accumulating layer was formed at the p+-n interface because of the continuous HVPE growth from the n-type drift layer to the p-type layer. This method provides improved electrical properties compared with the regrowth of p-type GaN layers. The minimum ideality factor of approximately 1.6 was obtained. The breakdown voltage increased from 874 to 974 V with the increase in the temperature from 25 to 200 °C, which suggests that avalanche multiplication causes the breakdown. The temperature-dependent breakdown voltage was in good agreement with the breakdown voltage calculated using the ideal critical electric field. These results indicate that HVPE is promising for the fabrication of vertical GaN power devices.

DOI： 10.1063/5.0066139

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Applied Physics  

In this study, vertical-type thick BGaN PIN diodes were successfully fabricated to improve the neutron capture rate of BGaN diodes by improving the BGaN epitaxial growth technique. In this technique, 5-μm-thick epitaxial growth was achieved using trimethylboron as a B metal-organic source, which suppressed the gas-phase reaction. The α-particle energy spectrum, the neutron pulse signal, and the residual energy of particles emitted from a neutron capture reaction were measured using the fabricated BGaN diodes by performing radiation detection measurements. The detected signal position in the neutron detection signal spectrum was similar to that of 2.3 MeV α-particles. These results indicate that vertical-type BGaN diodes can be used as effective neutron detectors.

DOI： 10.1063/5.0051053

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：ECS Journal of Solid State Science and Technology  

We have investigated the performance of AlGaInP-based red micro-light-emitting diodes (micro-LEDs) with different n-type contact schemes as functions of current, ambient temperature, and chip size. The samples with AuGe/Ni/Au contact revealed wider full width at half maximum of electroluminescence than that with the Pd/Ge contact. All samples also exhibited broad peaks at wavelengths between ∼632 and ∼640 nm, whose intensity depended on the type of contact schemes and temperature. Regardless of the contact schemes, the 10 μm-size samples showed a larger temperature-dependent reduction in the output power at current density of <50 A cm-2 than the 100 μm-size ones. Above 100 A cm-2, however, both samples showed similar temperature dependence. Irrespective of the contact schemes, the main peak of the 100-μm samples was red-shifted, whereas no red-shift was detected in the 10-μm samples. The third peak of the AuGe-based contact samples became more dominant at 700 A cm-2 than the main peak, whereas that of the PdGe contact samples became more dominant at 1000 A cm-2. Based on the chip size, current, contact scheme, and temperature dependence, the performance degradation of the red micro-LEDs is described and discussed.

DOI： 10.1149/2162-8777/ac2029

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Materials Today Physics  

The minimization of electronics makes heat dissipation of related devices an increasing challenge. When the size of materials is smaller than the phonon mean free paths, phonons transport without internal scattering and laws of diffusive thermal conduction need to be revisited. This work reports the temperature dependent thermal conductivity of doped epitaxial 6H–SiC and monocrystalline porous 6H–SiC below room temperature probed by time-domain thermoreflectance. Strong quasi-ballistic thermal transport was observed in these samples, especially at low temperatures. Doping and structural boundaries were applied to tune the quasi-ballistic thermal transport since dopants selectively scatter high-frequency phonons while boundaries scatter phonons with long mean free paths. Exceptionally strong phonon scattering by boron dopants are observed, compared to nitrogen dopants. Furthermore, orders of magnitude reduction in the measured thermal conductivity was observed at low temperatures for the porous 6H–SiC compared to the epitaxial 6H–SiC. Finally, first principles calculations and a simple Callaway model are built to understand the measured thermal conductivities. Our work sheds light on the fundamental understanding of thermal conduction in technologically-important wide bandgap semiconductors such as 6H–SiC and will impact applications such as thermal management of 6H–SiC-related electronics and devices.

DOI： 10.1016/j.mtphys.2021.100462

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics A: Materials Science and Processing  

Gallium nitride (GaN)-based devices surpass the traditional silicon-based power devices in terms of higher breakdown voltage, faster-switching speed, higher thermal conductivity, and lower on-resistance. However, heteroepitaxial GaN growths like GaN on sapphire are not suitable for power devices due to the threading dislocation densities as high as 108/cm2. Recently, homoepitaxial GaN growth has become possible thanks to the native GaN substrates with dislocation densities in the order of 104/cm2 but the extremely high cost of the GaN substrates makes the homoepitaxy method unacceptable for industrial applications, and the slicing of wafers for reusing them is an effective solution for cost reduction. In this study, we will investigate a route for slicing the GaN single crystal substrate by controlling the laser pulse energy and changing the distance between each laser shot. The 2D and 3D crack propagations are observed by a multiphoton confocal microscope, and the cross section of samples is observed by a scanning electron microscope (SEM). The results showed that two types of radial and lateral cracking occurred depending on the pulse energy and shot pitch, and controlling them was of importance for attaining a smooth GaN substrate slicing. Cross-sectional SEM images showed that at suitable pulse energy and distance, crack propagation could be controlled with respect to the irradiation plane.

DOI： 10.1007/s00339-021-04808-y

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：IEEE Electron Device Letters  

We demonstrated a prototype Gated Lateral power bipolar junction transistor (GLP-BJT) on wide bandgap semiconductor. The device combined the intrinsic advantages of high current gain of a Gated Lateral-BJT and good current handling and voltage blocking capabilities of GaN material. As a result, the common-emitter current gain remained over 300 at a high collector current density of 2 kA/cm2 despite a wide p-base region of 2 &#x03BC;m. The open base breakdown voltage BVCEO was over 300 V corresponding to a high critical field of 2.5 MV/cm. These figures of merit show great promise of GaN-based GLP-BJT in power applications and also shed light on the development of state-of-the-art bipolar transistors based on other wide bandgap semiconductors.

DOI： 10.1109/LED.2021.3099982

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.jallcom.2021.159629

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

In this study, we investigated the relationship of light output power with the optical thickness of the p-layers in AlGaN-based deep ultraviolet light-emitting diodes with a transparent high-Al-composition p-AlGaN clad layer, a thin p-GaN contact layer, and a reflective p-type electrode. By adjusting the thickness of the transparent high-Al-composition p-AlGaN clad layer, we observed a marked change in light output power. A maximum light output power of 385 mW at 1500 mA, a maximum external quantum efficiency of 15.7% at 10 mA, and a maximum wall-plug efficiency of 15.3% at 10 mA were obtained at an emission wavelength of 275 nm.

DOI： 10.35848/1882-0786/ac154c

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

We reduced the operating voltage of AlGaN homojunction tunnel junction (TJ) deep-ultraviolet (UV) light-emitting diodes (LEDs) by two approaches: the suppression of carbon incorporation and the doping of a high concentration of silicon in an n+-AlGaN layer. The AlGaN homojunction TJ deep-UV LEDs had a significantly reduced forward voltage upon suppressing the incorporation of carbon in the n+-AlGaN layer. The suppression of electron compensation by carbon in nitrogen sites and the doping of a high concentration of silicon in an n+-AlGaN layer are important for reducing the operating voltage of AlGaN homojunction TJ deep-UV LEDs.

DOI： 10.35848/1882-0786/ac0fb6

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Express  

The interface properties of GaN metal-insulator-semiconductor (MIS) structures with a gate electrode metal deposited by electron beam (EB) or resistive heating evaporation were investigated. Also, the impact of the interface properties on the channel mobility in GaN MIS field-effect transistors was investigated. It was confirmed that interface charges including both interface states and positive fixed charges were introduced to an Al2O3/GaN interface by the formation of a gate electrode by EB evaporation. Consequently, the introduced interface charges degraded the electron mobility in the MIS channel.

DOI： 10.35848/1882-0786/ac0ffa

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：Journal of Crystal Growth  

The electrical properties and structural defects of p-type GaN layers with Mg concentrations from 8.0 × 1018 to 8.3 × 1019 cm−3 grown by halide vapor phase epitaxy (HVPE) were investigated. In all samples, p-type conduction was confirmed at room temperature. The hole concentration at room temperature decreased in a heavily Mg-doped sample. By analyzing the results of Hall-effect measurements at various temperatures, the acceptor concentration decreased in a heavily Mg-doped sample, whereas the compensating donor concentration increased. These results affect the decrease in the hole concentration. The hole mobility decreased with increasing acceptor concentration. In the heavily Mg-doped sample, pyramidal inversion domains (PIDs) were formed. The size of each PID in an HVPE-grown sample is in good agreement with that Mg-doped GaN layers grown by metalorganic vapor phase epitaxy (MOVPE). Thus, the formation mechanism of PIDs in HVPE-grown samples is possibly the same as that in MOVPE-grown samples. Energy-dispersive X-ray spectroscopy shows that Mg atoms accumulate in PIDs, which suggests that Mg atoms in PIDs are electrically inactive, inhibiting the increase in the acceptor concentration. These results are useful guidelines for fabricating p-type GaN layers with higher hole concentrations by HVPE.

DOI： 10.1016/j.jcrysgro.2021.126173

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：公益社団法人 応用物理学会  

DOI： 10.11470/oubutsu.90.7_455

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：一般社団法人 日本物理学会  

<p>追悼</p><p>赤﨑　勇先生を偲んで</p>

DOI： 10.11316/butsuri.76.7_478

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Japanese Journal of Applied Physics  

An optimized top-down approach was utilized to fabricate vertical GaN-on-GaN nanowire Schottky barrier diodes (NWSBDs) in this letter. The suppressed reverse leakage current and enhanced breakdown voltage (BV) of the vertical GaN NWSBDs are attributed to the reduced electric field at the interface of the Schottky junction achieved through the dielectric reduced surface field technique. As-fabricated NWSBD delivers a low turn-on voltage of 0.80 V, a near-unity ideality factor of 1.04, along with a soft BV of 480 V. The measured soft BV is comparable with the avalanche BV of the p-n diode with a similar net doping concentration in the drift region.

DOI： 10.35848/1347-4065/ac06b5

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1002/pssa.202100329

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Applied Physics Letters  

We have demonstrated non-polar GaN power diodes (Schottky barrier diode and p-n junction diode) on foreign substrates featuring the true-lateral p-n and metal-semiconductor junctions. The diodes were fabricated on GaN islands laterally overgrown on the mask-patterned sapphire and Si substrates by metalorganic vapor phase epitaxy. The anode and cathode were formed on the opposed a-plane sidewalls of the island, making the device architecture essentially like the 90° rotation of the desired true-vertical power diodes. The ideality factor of the Schottky barrier diode remained 1.0 (from 1.00 to 1.05) over 7 decades in current. Specifically, a high critical electric field of 3.3 MV/cm was demonstrated on the p-n junction diode with avalanche capability. These performances reveal a strong potential of non-polar GaN with the true-lateral junctions for high power applications.

DOI： 10.1063/5.0051552

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Language：English   Publishing type：Research paper (scientific journal)   Publisher：Chemical Science  

A challenging approach, but one providing a key solution to material growth, remote epitaxy (RE)—a novel concept related to van der Waals epitaxy (vdWE)—requires the stability of a two-dimensional (2-D) material. However, when graphene, a representative 2-D material, is present on substrates that have a nitrogen atom, graphene loss occurs. Although this phenomenon has remained a hurdle for over a decade, restricting the advantages of applying graphene in the growth of III-nitride materials, few previous studies have been conducted. Here, we report the stability of graphene on substrates containing oxygen or nitrogen atoms. Graphene has been observed on highly decomposed Al2O3; however, graphene loss occurred on decomposed AlN at temperatures over 1300 °C. To overcome graphene loss, we investigated 2-D hexagonal boron nitride (h-BN) as an alternative. Unlike graphene on AlN, it was confirmed that h-BN on AlN was intact after the same high-temperature process. Moreover, the overgrown AlN layers on both h-BN/AlN and h-BN/Al2O3could be successfully exfoliated, which indicates that 2-D h-BN survived after AlN growth and underlines its availability for the vdWE/RE of III-nitrides with further mechanical transfer. By enhancing the stability of the 2-D material on the substrate, our study provides insights into the realization of a novel epitaxy concept.

DOI： 10.1039/d1sc01642c

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PubMed

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1347-4065/abd538

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/abf443

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1002/lpor.202000133

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/5.0042036

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/abe3dc

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/abf49b

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.3390/cryst11040356

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1038/s41598-021-86139-9

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PubMed

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1021/acs.cgd.0c01564

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/abe657

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.3390/cryst11030254

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.3390/qubs5010005

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/5.0034584

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1364/OME.420328

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021  

We reported the first-time utilization of ELO (epitaxial lateral overgrowth) GaN (gallium nitride) for power diodes. The undesired stage of coalescence related to ELO is avoided by virtue of a novel 3D device architecture built on the ELO GaN islands on foreign substrate which features pure-lateral p-n and n+ -n-junctions and electrodes lying on the opposing sidewalls of the island. Excellent electrical performance was demonstrated, revealing a strong potential of ELO GaN with 3D device architecture for power switching applications.

DOI： 10.1109/EDTM50988.2021.9420859

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Scopus

Language：English   Publishing type：Research paper (scientific journal)   Publisher：IEEE Journal of the Electron Devices Society  

Traditional lumped small signal equivalent circuit models of AlGaN/GaN metal oxide semiconductor high electron mobility transistors (MOS-HEMTs) are made up of constant valued circuit elements. Such models are unable to capture the high frequency behavior (above 20 GHz) of the device. In this work, a modified small signal equivalent circuit model of AlGaN/GaN MOS-HEMTs is presented. The key feature of the proposed model is that the values of the different circuit elements in the model are considered to be frequency dependent in nature and not constants. The frequency dependent value of each circuit element is mathematically represented using polynomial functions where the coefficients of the functions are determined via a least-square curve fitting approach. This frequency dependent attribute of the circuit element values ensures that the proposed model is very accurate at high frequencies without sacrificing the compactness of the model topology. The accuracy of the proposed model has been verified up to 50 GHz using experimentally measured Y-parameters of AlGaN/GaN MOS-HEMTs having a different gate dielectric and gate length.

DOI： 10.1109/JEDS.2021.3081463

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

DOI： 10.1117/12.2575872

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Proceedings of SPIE - The International Society for Optical Engineering  

DOI： 10.1117/12.2578134

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/5.0028516

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Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.1088/1361-6463/aba64c

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/abcb49

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.surfin.2020.100765

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1038/s41598-020-76042-0

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PubMed

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1088/1361-6641/abad73

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1364/PRJ.401785

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1021/acsami.0c11883

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PubMed

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/5.0027789

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.1364/OME.401765

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Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/abb786

Scopus

Authorship：Lead author   Language：Japanese   Publishing type：Research paper (scientific journal)  

Other Link： https://www.journal.ieice.org/bin/pdf_link.php?fname=k103_10_1016&lang=J&year=2020

Language：English   Publishing type：Research paper (scientific journal)  

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Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.nimb.2020.06.007

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/5.0010774

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Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1347-4065/abaac6

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

Web of Science

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1103/PhysRevApplied.14.024018

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Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1347-4065/aba0d5

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/aba494

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

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Language：Japanese   Publishing type：Research paper (scientific journal)  

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1039/d0tc01369b

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/5.0010664

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/ab93a0

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

Web of Science

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1002/pssa.201900955

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Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.jcrysgro.2020.125643

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/ab9166

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

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Language：English   Publishing type：Research paper (scientific journal)  

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1002/pssr.202000142

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.3390/mi11050519

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PubMed

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/ab915d

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Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1347-4065/ab8b3d

Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1882-0786/ab8723

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

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Language：Japanese   Publishing type：Research paper (scientific journal)  

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/ab8b6f

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1103/PhysRevMaterials.4.044602

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1039/c9ce01971e

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1109/LPT.2020.2977376

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.jcrysgro.2020.125522

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1002/pssb.201900553

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/1.5145017

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/ab7c40

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1093/jmicro/dfz037

Scopus

PubMed

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/ab74c3

Web of Science

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：ECS Journal of Solid State Science and Technology  

We have investigated how different types of the reflectors affected the optical and electrical performance of AlGaInP-based micro-LEDs. Simulations showed that the AlGaAs-based epitaxial distributed Bragg reflector (DBR) had a stopband at the 610–624 nm region with reflectivity of 90%, the SiO2/TiO2 dielectric DBR gave a stopband at the 580–770 nm range with a maximum reflectivity of 99%, and the ITO/Ag metal reflector exhibited reflectivity of 90% across the 400–800 nm region. All micro-LEDs gave forward voltages of 1.895–1.960 V at 20 μA. The micro-LEDs with the dielectric DBR and metal reflector yielded 31% and 13% higher light output at 20 μA than that with the epitaxial DBR, respectively. All of the micro-LEDs contained a shoulder peak at approximately 615 nm in their electroluminescence spectra. Ray-tracing simulations exhibited that the micro-LEDs with the dielectric DBR and metal reflector produced 26% and 22% higher total light output power than the one with the epitaxial DBR, respectively. It was also shown that for the micro-LEDs with the metal reflector, some of the micro-LEDs were detached from the metal reflectors due to the interfacial voids induced as a result of agglomeration of Ag layer during fabrication process.

DOI： 10.1149/2162-8777/ab74c3/pdf

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.mee.2020.111229

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1088/1361-6463/ab52d0

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/ab709a

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/ab709a

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2162-8777/aba914

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.7567/1347-4065/ab65cd

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1116/1.5120417

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1088/2053-1583/ab46e6

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2.0452001JSS

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1088/1361-6641/ab63f1

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.35848/1347-4065/ab6fb0

Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1109/LPT.2020.3010820

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japanese Association for Crystal Growth  

<p>  The microscopic structural and optical characteristics of AlGaN light-emitting diodes (LEDs) fabricated on the AlN templates with dense macrosteps are shown to clarify the origin of their high internal quantum efficiency of radiation (IQE). The cross-sectional transmission electron microscopy observations under the high-angle annular dark field scanning mode and microscopic energy dispersive X-ray spectroscopy revealed that the AlGaN cladding layer under the AlGaN quantum well (QW) layer had a microscopic compositional modulation, which originates from the macrosteps at the AlN template surface. Moreover, Ga-rich portions in the cladding layer behaved as current micropaths, and the micropaths are connected with the carrier localization structure formed in QWs. The in-plane cathodoluminescence (CL) spectroscopy showed a significant inhomogeneity of the CL characteristics. The gentle slopes at the sample surface showed brighter emissions with a lower peak photon energy, confirming the carrier localization. This carrier localization structure in the QWs combined with the current micropaths in the cladding layer can increase the IQE as well as external quantum efficiency of the AlGaN LEDs.</p>

DOI： 10.19009/jjacg.47-3-04

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1109/ispsd46842.2020.9170101

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Scopus

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1117/12.2544704

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Language：English   Publishing type：Research paper (scientific journal)  

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Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Japan Society of Mechanical Engineers  

DOI： 10.1299/jsmemecj.2020.s16306

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：The Laser Society of Japan  

A UV-C laser diode is a promising light source for processing and machining applications due to photon
energy near 5 eV. Recently, our group reported a 272-nm laser diode (LD) fabricated on a high-quality
AlN substrate. Several key technologies are involved to achieve lasing; a low-dislocation-density AlN
substrate to reduce waveguide optical loss, and distributed polarization doping to increase the hole density
in the p-side AlGaN cladding of high Al composition. After introducing these key technologies, we
describe a highly productive on-wafer laser fabrication process in which a facet mirror is prepared by
dry- and wet-etching and coated with atomic layer deposited DBR (Distributed Bragg Reflector). These
technologies are expected to open up new UV-C applications and be widely implemented around the
world.

DOI： 10.2184/lsj.48.8_427

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2.0462001JSS

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Scopus

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/1.5125623

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1002/pssb.201900554

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.7567/1882-0786/ab50e0

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1088/1361-6641/ab4d2c

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.3390/s19235107

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PubMed

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2.0332001JSS

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1038/s41598-019-52067-y

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.7567/1882-0786/ab45d1

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/1.5114866

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.microrel.2019.113418

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1149/2.0171909jss

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.jallcom.2019.05.070

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.3390/ma12162583

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1002/admi.201900821

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.7567/1347-4065/ab26ad

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.7567/1347-4065/ab2657

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1016/j.jcrysgro.2019.03.025

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1063/1.5097767

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.7567/1347-4065/ab124e

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Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.7567/1347-4065/ab06ae

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Language：English   Publishing type：Research paper (scientific journal)